Principal Analog Engineer for Sustaining Product Engineer

Job description

Principal Analog Engineer for Sustaining Product Engineer is responsible for sustaining and continuously improving discrete power MOSFET products throughout their production lifecycle. This role drives manufacturing yield improvement, customer quality support, cost optimization, process transfers, and long-term product reliability for automotive and industrial power semiconductor applications. The ideal candidate brings more than 15 years of semiconductor industry experience, including extensive expertise in discrete MOSFET technologies, wafer fabrication, assembly, test, reliability, and high-volume manufacturing environments.

This individual will serve as a technical leader, working closely with Product Engineering, Manufacturing, Quality, Reliability, Operations, and major customers to ensure sustained product competitiveness and operational excellence. Renesas Electronics is expanding its power semiconductor portfolio to support high-growth markets including automotive electrification, industrial power management, AI infrastructure, and energy-efficient computing.

The discrete MOSFET portfolio includes low-voltage and medium-voltage MOSFETs, trench MOS technologies, and advanced power packaging solutions.

Key Responsibilities

Own sustaining engineering activities for released Discrete MOSFET products in mass production. Drive yield improvement through detailed electrical data analysis, defect signature identification, root-cause investigation, and corrective action implementation. Lead customer return investigations and failure analysis activities, coordinating corrective and preventive actions across global teams. Identify and execute cost reduction initiatives including test optimization, assembly yield improvement, wafer cost reduction, and scrap reduction.

Support product qualifications, PCNs, process changes, technology migrations, and manufacturing transfers. Monitor key manufacturing indicators, parametric trends, reliability data, and outgoing quality metrics. Drive resolution of cross-functional issues spanning wafer fabrication, assembly, test, reliability, and customer applications. Support product EOL activities, last-time-buy planning, and risk mitigation strategies.

Provide technical leadership to global manufacturing sites and serve as escalation point for sustaining issues. Maintain product history, lessons learned, and sustaining engineering best practices.

Qualifications

Education

Bachelor's Degree in Electrical Engineering, Electronics Engineering, Materials Science, Physics, or related discipline. Master's Degree preferred.

Experience & Skills

15+ years of semiconductor industry experience, with a strong background in Discrete MOSFET products.

Proven experience within leading semiconductor companies such as: Infineon / onsemi / Vishay/ Alpha & Omega Semiconductor (AOS)/ ROHM/ Toshiba/ Nexperia/ STMicroelectronics / Renesas Deep understanding of MOSFET device physics, trench technologies, RDS(on) optimization, reliability mechanisms, and power semiconductor manufacturing. Strong experience in yield analysis, device characterization, statistical process control, and failure analysis.

Expertise in semiconductor wafer fabrication, assembly, packaging, and final test processes. Experience analyzing ATE data and production electrical distributions. Proven ability to identify yield signatures and drive corrective actions across multiple manufacturing sites. Strong knowledge of automotive and industrial quality requirements. Experience supporting customer escalations and technical issue resolution. Proficiency in data analysis tools such as JMP, Python, SQL, Excel, or equivalent.

Excellent communication and leadership skills in cross-functional global organizations. Ability to manage multiple technical priorities in high-volume manufacturing environments.

Preferred Qualifications

Experience supporting Automotive MOSFET products and AEC-Q101 qualification activities. Familiarity with advanced power packages including DFN, PQFN, LFPAK, TOLL/TOLG, DPAK, D2PAK, TO-Leadless, and automotive power packaging technologies. Experience with wafer fabs and OSAT manufacturing partners across Asia.