Staff Package Design Engineer - Cu FSM/BGBM/Bumping 封装设计专家

Job description

Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules , wafer level chip scale package, flip-chip, multi-chip module LGA and power device packaging. Strong understanding on wafer processing such as Cu Front side of metal/Backgrind Backmetal, Taiko Backgrinding, Glass carrier bonding&grinding, Patterned back metal, Cu pillar bumping technology. Package technologies qualification for consumer & industrial power as well as automotive power applications.

Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM). Work with OSAT/CM to develop, run DOE to optimize processes and establish process spec. Work with Product groups and Reliability team, qualify new packages and processes within required time frame. Resolve all process integration issues by ensuring all window checks are done on critical process steps.

Establish production controls and monitor to ensure there is no room for quality incidents. Ensure smooth transition into production & implement ramp up monitor. Work with OSAT/CM to monitor and resolve process issues early in the production to ensure only parts with superior quality shipped to customer. Develop and maintain technical expertise on advances and innovations in power SiP/modules, wafer level packaging & flip chip interconnects.

Participate in packaging roadmap development & focus on execution. Address internal and external customer complains working with peers of Marketing, Product groups, Quality and Operations organization to satisfy growth in businesses. Establish & maintain package design rules.

Qualifications

• Doctorate/Masters / Bachelor Degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.
• 6-12 years of relevant experience in package development emphasizing power SiP/module, wafer level & flip-chip packaging.
• Strong understanding of Cu FSM/BGBM & Bumping process (Evaporation & Sputtering), assembly process knowledge, qualification methods, SPC and statistical analysis software. Knowledge of embedded substrate technologies a plus
• Strong interpersonal and communication skills.
• Strong analytical and presentation skills.