Infineon Technologies · Villach

Staff Engineer Simulation and Package Design Methodology (f/m/div)

VillachSenior individual contributorDesign

Listed on Infineon Technologies’s official careers site. Posted September 18, 2026. Check that it is still open and apply there.

Apply on Infineon Technologies’s careers site →

The employer’s listing has no description we could read. See it on their site.

More jobs at Infineon Technologies

Senior Engineer Analog Mixed-Signal Design (f/m/div)

Villach

Senior Staff Engineer Module Design (f/m/div)

Villach

Staff Engineer Analog Design (f/m/div)

Villach

Bachelor Thesis - Artificial Intelligence in Microcontroller (f/m/div)

Villach

Industriepraktikum - Global Procurement Facility Management (w/m/div)

Villach

Similar jobs at other companies

Staff Engineer, Packaging Engineering, Structural Simulation

Sandisk

IC Package Design Engineer, Staff

Qualcomm · Hsinchu City, Taiwan

Package Manufacturing Engineer, Senior to Staff Level (Kaohsiung or Taichung)

Qualcomm · Kaohsiung, Taiwan, Taichung, Taichung City

Package Design Staff/Sr.Staff Engineer

Marvell Technology · Bangalore

Simulation Model Engineer

Hitachi · Ludvika, Dalarna County, Sweden

OpenNash lists jobs from employers’ own careers sites and does not handle applications. Dates come from the employer where stated; “first seen” and “last checked” are our own observations.