Staff Packaging Design Engineer封装开发工程师 （功率模块）

Job description

Design and develop Power Modules which use embedded die laminate technology with SMT of Cap and Inductor for Renesas’s packaging needs in the areas of Commercial Industrial power device packaging for servers and AI. Define package technologies tooling & qualification for Commercial Industrial power device packaging for servers and AI power applications. Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT Outsourced Semiconductor Assembly & Test).

Work with Renesas product designers to develop detailed Power Module package drawings for plastic packages using AutoCAD. Work with OSAT (Outsourced Semiconductor Assembly & Test) to run DOE to optimize processes and establish process spec. Work with Product groups and Reliability team, qualify new packages and processes within required schedule from Product Engineer/Program manager. Develop and maintain technical expertise on advances and innovations Power Module plastic packages.

Participate in packaging roadmap development & focus on execution.

Qualifications

Doctorate/Masters / bachelor’s degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering. 5-12 years of relevant experience in package development emphasizing Power Module plastic package Understanding of semiconductor Power Module plastic IC assembly processes, materials and technology. Knowledge of AutoCAD, Excel, PowerPoint, Word. Knowledge of wire-bonding, flip chip, SMT SPC(Statistical Process Control) and statistical analysis.

Strong interpersonal and communication skills. Strong analytical and presentation skills.