Dir, Package Design Engineering

Job description

Responsibilities

Lead the global Packaging Sustaining Engineering organization supporting high-volume semiconductor manufacturing across internal assembly sites and OSAT partners throughout Asia, ensuring manufacturing excellence, customer satisfaction, yield, quality, reliability, cost competitiveness, and strategic supplier management. Responsible for Japan Assembly Engineering (PAE1) and Malysia Assembly Engineering (PAE3) Groups. Work with Package Development Group (NPI).

Takeover qualified products from NPI for mass production. Work with Supply Chain Management (SCM). Address Capacity or Material supply issues to secure on time delivery. Work with OSATs and QA to address assembly related quality or customer RMA issues. Work with Procurement, SCM, and Package Development to define Renesas OSAT strategy. Do the industry benchmarking on substrate suppliers, material suppliers, equipment suppliers, and competitors.

Do the literature survey and perform competitive analysis. Address PCN and PDN issues. Publish Weekly Assembly Engineering Statistics. Define action plans for yield improvement, cost reduction, cycle time reduction, and continuous improvement.

Dimensions

Global responsibility across Asia Internal factories and multiple OSAT partners Executive ownership of HVM sustaining. Global customer support Lead geographically distributed engineering teams Own manufacturing excellence, supplier governance, cost reduction, and HVM sustaining Principal Accountabilities: Lead Manufacturing Sustaining Engineering for all released production packages. Own Customer RMA, failure analysis, RCA, CAPA and customer communications.

Drive Yield Improvement and Process Excellence using SPC, DOE, PFMEA and analytics. Lead Cost Optimization through process, material and manufacturing improvements. Own Product Change Notification (PCN) planning, qualification and implementation. Lead Material Review Board (MRB) and disposition of abnormal materials/products. Manage OSAT suppliers, supplier audits, scorecards and technology alignment

Qualifications

Requirements

15+ year Assembly Engineering experience MS or Ph.D. degree, Material Science or Mechanical Engineering Excellent communication, documentation, and schedule management skills Excellent leadership, communication and customer management skills. Solid OSAT management experience Extensive experience supporting high-volume manufacturing across multiple semiconductor package platforms. Automotive Packaging experience Assembly experience on various packages.

FCCSP, FCQFN, FCBGA, QFN, QFP, WLCSP, SiP, Module, and 2.5D. Package substrates experience on MSAP, ETS, Tenting, and ABF substrates. SMT process, Warpage, and Board Level Reliability testing experience Familiar with Industry standards. JEDEC, IPC, Automotive quals, and others Familiar with SPC, 8D, RCA, SYL/SBL.