Assembly Process Manufacturing Engineer for Back End Fab
Listed on Renesas Electronics’s official careers site. Posted October 21, 2026. Check that it is still open and apply there.
Apply on Renesas Electronics’s careers site →Job description
Launched assembly process production technology for high-quality automotive SOC products and launched a new AI-related power module line. ・Responsible Technology: Production technology (Process, Equipment, Material) ・Products handled: Automotive SOC, AI-related power modules ・Responsibilities: Activities to improve the productivity, quality, and yield of automotive SOC. And also responsible for launching the newly developed AI-related power module assembly line.
Qualifications
【MUST】 ・Experience as a semiconductor back-end process engineer ・Practical engineering experience in either package sealing, stamping, or PKG dicing 【WANT】 ・Knowledge of the entire semiconductor assembly process ・Image Processing Inspection Technology ・Knowledge of Statistics ・Knowledge of Quality Control ・Presentation skills
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