All Micron Technology jobs, page 17 of 30
2,907 jobs listed on Micron Technology’s official careers site. Each links to its own page with the description and the employer’s application link.
- Principal Foundry Interface Design Engineer, HBM
- Principal Global Account Manager, Storge Accounts San Jose, CA
- Principal Global Sales Account Manager, Cloud/AI Storage San Jose, CA
- Principal HBM Architecture & Circuit Design Engineer
- Principal HBM Architecture & Circuit Design Engineer Richardson, TX +1 more
- Principal HBM Architecture & Circuit Design Engineer Richardson, TX +1 more
- Principal HBM Architecture & Circuit Design Engineer Richardson, TX +2 more
- Principal HBM Design Architect Richardson, TX
- Principal HBM Design Architect Richardson, TX
- Principal HBM Design Architect Richardson, TX
- Principal HIG ESD and Latch-up Engineer- HBM - TPG Hsinchu, Taiwan
- Principal Hardware Engineer, SSD
- Principal Layout Designer Hyderabad - Phoenix Aquila, India
- Principal Layout Designer, Next-generation HBM Architecture
- Principal Layout Engineer-DPG-LPDDR Hyderabad - Phoenix Aquila, India
- Principal Memory Design Engineer, HBM Richardson, TX
- Principal NAND Reliability Product Engineer Singapore
- Principal PCIe Application Engineer San Jose, CA
- Principal Physical Design Boise, ID - Main Site
- Principal Process Engineer, Die Bonding Boise, ID - Main Site
- Principal Product Architect
- Principal Product Engineer (AI/ML & Advanced Data Analytics Lead), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM) Product Engineering Singapore
- Principal Product Line Manager
- Principal Product Marketing Manager - Cloud Memory
- Principal Product Owner , SMART MFG & AI Singapore
- Principal Product Quality Engineering Taiwan
- Principal RDA Process Engineer Boise
- Principal Recruiter U.S. Expansion Global Ops Clay, NY
- Principal SSD Applications Engineer
- Principal SSD Systems Design Engineer Longmont-MAX-, CO
- Principal Signal Integrity Engineer
- Principal Signal Integrity Engineer, Pathfinding
- Principal Specialist, Global People Services (HR) Singapore
- Principal System Architect San Jose, CA
- Principal Technical Product Manager
- Principal Technical Product Manager
- Principal Technical Product Manager
- Principal Thin Films Engineer, Advanced Packaging Boise, ID - Main Site
- Principal University Recruiting Leader
- Principal Wet Process Engineer, Advanced Packaging Boise, ID - Main Site
- Principal, AI Security Engineer Boise, ID - Main Site
- Principal, ER Country Lead
- Principal, Global Account Sales Taipei - MTT, Taiwan
- Principal, Global Leadership & Organization Capability
- Principal, Global Leadership & Organization Capability Penang, Malaysia - Grande
- Principal, MTS, DRAM Systems Architect Boise, ID - Main Site
- Principal, Program Manager Source to Pay - AI Workflow
- Principal, Regional Talent Development Singapore
- Principal, Requirements & Planning Manager-LPDRAM Boise, ID - Main Site
- Principal, SMTS, DRAM Systems Architect Boise, ID - Main Site
- Principal, Social Impact & Community Engagement Syracuse, NY - Downtown
- Principal/MTS Vapor/Thermal Etch Development Engineer, Advanced DRAM Wet Etch Boise, ID - Main Site
- Principal/MTS Wet Process Development Engineer, DRAM Wet Process (Evergreen) Boise, ID - Main Site
- Principal/MTS, Analog Design Engineering Boise, ID - Main Site
- Principal/MTS, Analog Design Engineering Boise, ID - Main Site
- Principal/Senior Engineer, Dry Etch Tool Installation Qualification Taiwan
- Principal/Staff Engineer, FE OCT Materials Cost
- Principal/Staff Engineer, FE OCT Materials Cost Singapore
- Principal/Staff Engineer, FE OCT TIQ Singapore
- Principal/Staff Engineer, FE OCT TIQ Taiwan
- Principal/Staff Engineer, Frontend Operations Central Team Materials Cost Japan
- Principal/Staff Engineer, PCVD Film Deposition, TD Singapore
- Principal/Staff Engineer, Process Integration, NTI NAND Singapore
- Principal/Staff ML/AI Engineer, Product Engineering, STPG Singapore
- Principal/Staff ML/AI Engineer, Product Engineering, STPG Singapore
- Principal/Staff Process Integration Engineer Japan
- Principal/Staff Process Integration Engineer, NAND Technology Integration Singapore
- Principal/Staff/Senior Engineer, Package Characterization - APTD Singapore
- Probe Equipment Engineer Manassas
- Probe Equipment Shift Engineer Tainan, Taiwan
- Probe HBM application integration engineer Taichung - TCP, Taiwan
- Probe Integration Engineer (Test Solutions Engineering) MSB, Singapore
- Probe Manufacturing Shift Engineer Singapore
- Probe Process Technician Singapore
- Probe Production Technician Japan
- Process & Equipment Engineer Singapore
- Process & Equipment Engineer Singapore
- Process & Equipment Engineer Singapore
- Process & Equipment Engineer Fab Support Singapore
- Process Analysis Engineer Taichung - MTB, Taiwan
- Process Control Engineer (Run-To-Run) Boise, ID - Main Site
- Process Control Engineer (Systems) MSB, Singapore
- Process Control System Engineer Hyderabad - Phoenix Aquila, India
- Process Control Systems Engineer Manassas
- Process Engineer Manassas
- Process Engineer, APTD Boise, ID - Main Site
- Process Engineer, Photomask Inspection Boise, ID - Main Site
- Process Integration & Yield Enhancement Engineer
- Process Integration & Yield Enhancement Engineer
- Process Integration Engineer - DRAM, DMTS Boise, ID - Main Site
- Process Integration Engineer, APTD Boise, ID - Main Site
- Process Integration Lead Taiwan
- Process Integration Manager Taiwan
- Process Integration Program Engineer Boise
- Process Kit & Calibration Technician Boise
- Process QE Engineer - CSM FDC Taiwan
- Process QE Engineer - QCM QMS2 Taiwan
- Process QE Technician Taiwan
- Process QE Technician Taiwan
- Process Technician Manassas