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All Micron Technology jobs, page 16 of 30

2,907 jobs listed on Micron Technology’s official careers site. Each links to its own page with the description and the employer’s application link.

  1. Principal Analog Design Engineer — Mixed-Signal PHY (Clocking / High-Speed I/O)
  2. Principal Analog Design Engineer, HBM Richardson, TX
  3. Principal Analog Verification Engineer Boise, ID - Main Site
  4. Principal Architect, IT Procurement Boise, ID - Main Site
  5. Principal Business Development Manager, Memory Cloud Portfolio
  6. Principal CAD Engineer San Jose, CA
  7. Principal CAD Engineer / Electronic Design - Munich (m/f/d) Munich, Germany
  8. Principal Capital Supplier Manager Taiwan
  9. Principal Category Sourcing Manager San Jose, CA
  10. Principal Compute Pathfinding ASIC Design
  11. Principal Corporate Narrative & Messaging Lead
  12. Principal Customer Integration Engineer, Product & Process Engineering (HBM) Boise, ID - Main Site
  13. Principal Cybersecurity Domain Architect
  14. Principal Design Automation Engineer San Jose, CA
  15. Principal Design Engineer San Jose, CA
  16. Principal Design Engineer San Jose, CA
  17. Principal Design Engineer San Jose, CA
  18. Principal Design Engineer, DRAM Boise, ID - Main Site
  19. Principal Design Engineer, DRAM Boise, ID - Main Site
  20. Principal Design Engineer, HBM Richardson, TX
  21. Principal Design Engineer, HBM Architecture Richardson, TX
  22. Principal Design Verification Engineer, HBM Richardson, TX
  23. Principal Design Verification Quality Engineer Boise, ID - Main Site
  24. Principal Device Engineer
  25. Principal EUV Lithography Pathfinding Engineer Boise, ID - Main Site
  26. Principal Engineer Hyderabad - Phoenix Aquila, India
  27. Principal Engineer , CMP Advanced NAND Singapore
  28. Principal Engineer - Analog Design Bengaluru, India
  29. Principal Engineer - Analog Design Bengaluru, India
  30. Principal Engineer - Design Verification Hyderabad - Phoenix Aquila, India
  31. Principal Engineer - Dry Etch, Operations Central Teams - Advanced Development Team Japan
  32. Principal Engineer - Firmware Development (SSD) MSB, Singapore
  33. Principal Engineer - HIG Component Validation Boise, ID - Main Site
  34. Principal Engineer - HIG HBM - ARCHITECTURE Richardson, TX
  35. Principal Engineer - Memory Circuit Design Verification Hyderabad - Phoenix Aquila, India
  36. Principal Engineer - Metals/Implant, Operations Central Teams - Advanced Development Team Japan
  37. Principal Engineer - SSD Hardware Design Bengaluru, India
  38. Principal Engineer - Signal Integrity Boise, ID - Main Site
  39. Principal Engineer - Validation SSD NVMe/PCIe Bengaluru, India
  40. Principal Engineer / MTS – NAND Process Pathfinding - Thin Films Singapore
  41. Principal Engineer / MTS – NAND Process Pathfinding – Dry Etch Singapore
  42. Principal Engineer / MTS, PDE Package Design MSB, Singapore
  43. Principal Engineer Advanced DRAM PI Boise, ID - Main Site
  44. Principal Engineer Advanced Package Technology Development Singapore
  45. Principal Engineer HBM Tapeout Execution & Release Coordination Richardson, TX
  46. Principal Engineer Lead - Track and Trim Equipment Dev Boise, ID - Main Site
  47. Principal Engineer Photolithography DRAM Process Development (Evergreen) Boise, ID - Main Site
  48. Principal Engineer – 3D NAND Process Integration Singapore
  49. Principal Engineer – ASIC SoC Design Hyderabad - Phoenix Aquila, India
  50. Principal Engineer – HBM PE Component Validation (Singapore) Singapore
  51. Principal Engineer – HBM PE Component Validation (Singapore) Singapore
  52. Principal Engineer – NAND Process Pathfinding – Dry Etch Singapore
  53. Principal Engineer – PD Adv Dry Etch Singapore
  54. Principal Engineer – Process Development, Cell Film, NAND Singapore
  55. Principal Engineer – Process Development, Dry Etch, NAND Singapore
  56. Principal Engineer – Process Development, Photolithography, NAND Singapore
  57. Principal Engineer – Process Development, Thin Film (CVD/Diffusion), NAND Singapore
  58. Principal Engineer – Process Development, Wet, NAND Singapore
  59. Principal Engineer, (NAND Cell Film Process) Singapore
  60. Principal Engineer, APTD Boise, ID - Main Site
  61. Principal Engineer, ASIC Design San Jose, CA
  62. Principal Engineer, ASIC Physical Design Hyderabad - Phoenix Aquila, India
  63. Principal Engineer, ASIC Validation Hyderabad - Phoenix Aquila, India
  64. Principal Engineer, ATCQE Singapore
  65. Principal Engineer, CAD Jalisco, Mexico
  66. Principal Engineer, Customer Validation Longmont-MAX-, CO
  67. Principal Engineer, Design Tokyo, Japan
  68. Principal Engineer, ESSD Firmware Developer
  69. Principal Engineer, ESSD Firmware Developer Hyderabad - Phoenix Aquila, India
  70. Principal Engineer, Films - Procurement and Operations Central Team Advanced Development Japan
  71. Principal Engineer, Films/Diffusion - Procurement and Operations Central Team Advanced Development Japan
  72. Principal Engineer, Firmware & Product Test
  73. Principal Engineer, Firmware & Product Test Longmont-MAX-, CO
  74. Principal Engineer, Firmware Development (SSD) MSB, Singapore
  75. Principal Engineer, Frontend Organizations Central Team, Dry Etch Process Japan
  76. Principal Engineer, Frontend Organizations Central Team, Wet Process Japan
  77. Principal Engineer, HBM Design Verification Hyderabad - Phoenix Aquila, India
  78. Principal Engineer, HIG-HBM Design Richardson, TX
  79. Principal Engineer, HIG-HBM Product Engineering (Media Health Manufacturing) Singapore
  80. Principal Engineer, IO Design Boise, ID - Main Site
  81. Principal Engineer, Memory CAD Engineering Richardson, TX
  82. Principal Engineer, NAND Advanced Thin Films Process Development Singapore
  83. Principal Engineer, NAND TD, RDA Singapore
  84. Principal Engineer, PD Adv NAND Cell Film Singapore
  85. Principal Engineer, PD SG Thin Film (CVD/Diffusion) Singapore
  86. Principal Engineer, RET Design Boise, ID - Main Site
  87. Principal Engineer, Region E, Operations Central Teams Advanced Development Team Japan
  88. Principal Engineer, SSD Systems Design Longmont-MAX-, CO
  89. Principal Engineer, SSD Validation
  90. Principal Engineer, SSD Validation MSB, Singapore
  91. Principal Engineer- DEG Layout Bengaluru, India
  92. Principal Engineer- DEG Layout Bengaluru, India
  93. Principal Engineer- HIG HBM Layout Hyderabad - Phoenix Aquila, India
  94. Principal Engineer- HIG HBM Layout Hyderabad - Phoenix Aquila, India
  95. Principal Engineer- HIG HBM Layout Hyderabad - Phoenix Aquila, India
  96. Principal Engineer/MTS, DRAM PI Japan
  97. Principal Engineer/MTS, Process Development, Photolithography, NAND Singapore
  98. Principal Engineer/Manager – NVMQRA Longmont-MAX-, CO
  99. Principal Firmware Developer, HBM Richardson, TX
  100. Principal Foundry Interface Design Engineer, HBM

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