MediaTek · HsinChu
Advanced MCM Packaging Technology Development & Integration
Listed on MediaTek’s official careers site. Listed as of November 6, 2026. Check that it is still open and apply there.
Apply on MediaTek’s careers site →Job description
Advanced Technology & Architecture Development
- Lead feasibility assessment and development of advanced packaging technologies for wafer-level and panel-level applications, including 2.5D/3D/3.5D integration and Fan-out packaging.
New Product Introduction (NPI) & Mass Production Improvement
- Plan pilot production processes, design and execute DOE (Design of Experiments), lead yield analysis and engineering issue resolution, and drive yield improvement for mass production.
Application-Specific Packaging Solutions
- Develop packaging solutions for logic and high-bandwidth memory integration, including HBM and LPDDR.
Supply Chain & Outsourced Manufacturing Management
- Manage technical collaboration with wafer foundries, OSATs, and substrate suppliers, including technical evaluation, cost structure analysis, and production line audits.
Cross-Functional Project Leadership
- Lead cross-functional collaboration across IC design, layout, testing, quality assurance, and reliability teams to ensure projects meet technical targets and schedule requirements. #LI-JK1
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