Silicon Technology Research and Development Hardware Engineering Intern 2027

Job description

Introduction

IBM Research is seeking intern candidates who want to apply their classroom learnings to real world challenges. As a Hardware Engineer Intern in semiconductor research, you will work with world-class global researchers focused on enabling next-generation chips and systems that support the tremendous processing power and unprecedented speeds required for next generation logic/memory technology and support applications such as quantum silicon and artificial intelligence.

Your role and responsibilities

In this role, you will investigate the feasibility of applying science and engineering principles towards innovative, new hardware design and applications from state-of-the-art chip architecture, design, fabrication and test to advanced chip packaging. Background knowledge of engineering disciplines, computer science, physics, or materials science are ideal skills for this role. Interns are expected to have the ability to analyze complex problems and apply creative solutions to groundbreaking hardware engineering projects.

Required technical and professional expertise

Electrical engineering/Mechanical Engineering/Computer Science/Materials Engineering/Physics/Chemistry

Preferred technical and professional experience

Semiconductor fabrication knowledge and/or coursework. IBM is committed to creating a diverse environment and is proud to be an equal-opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, gender, gender identity or expression, sexual orientation, national origin, caste, genetics, pregnancy, disability, neurodivergence, age, veteran status, or other characteristics.

IBM is also committed to compliance with all fair employment practices regarding citizenship and immigration status.