Advanced DRAM plasma etch engineer

Job description

Introduction

At IBM Research, we are the innovation engine of IBM. Exploring what’s next in computing and shaping the technologies the world will rely on tomorrow. From advancing AI and hybrid cloud to pioneering practical quantum computing, we anticipate challenges and unlock new opportunities for clients, partners, and society. Working in Research means joining a team that accelerates discovery at the intersection of high-performance computing, AI, quantum, and cloud.

You’ll collaborate with leading scientists, engineers, and visionaries to push boundaries and turn ideas into reality. With a culture built on curiosity, creativity, and collaboration, IBM Research offers the opportunity to grow your career while contributing to breakthroughs that transform industries and change the world.

Your role and responsibilities

We are seeking a highly experienced and innovative Senior DRAM Plasma Etch Engineer to drive advanced DRAM technology research and development. This role is critical to enabling next-generation memory technologies through the development of leading-edge plasma dry etch solutions and pattern transfer technologies for advanced DRAM architectures. The successful candidate will develop novel dry etch processes that enable future DRAM physical and electrical architectures.

This individual will work closely with cross-functional teams spanning process integration, patterning, metrology, and device engineering while partnering with equipment and materials suppliers to overcome emerging technology challenges. The ideal candidate is a recognized technical leader in DRAM dry etch technology with demonstrated expertise through industry experience, technical leadership, patents, publications, or significant project accomplishments.

This role requires both strategic vision and hands-on technical execution to define and implement advanced etch solutions from concept through manufacturing implementation. The candidate will provide both technical and strategic leadership for next-generation plasma dry etch development, influence DRAM technology roadmaps, and lead complex development programs across multi-functional teams and external partners Required technical and professional expertise

• Minimum 5 years of plasma dry etch process development experience and DRAM technology development experience
• Demonstrated expertise in advanced semiconductor etch process development and integration.
• Strong understanding of plasma etch fundamentals, reactor operation, process characterization, and process integration.
• Experience with experimental design, statistical data analysis, and process optimization methodologies.
• Proven ability to lead multi-functional projects and communicate effectively with internal and external collaborators.
• Demonstrated success driving process capability, yield, and reliability improvements through structured problem solving and data-driven experimentation Preferred technical and professional experience
• 8+ years of DRAM technology development experience.
• 8+ years of advanced plasma dry etch experience.
• 5+ years developing or influencing dry etch roadmaps for DRAM technologies.
• Experience developing advanced DRAM, 3D device, or other leading-edge semiconductor technologies
• Demonstrated success leading technical teams, mentoring engineers, or managing complex development programs
• Strong publication, patent, or industry-recognized technical achievement record.
• Experience with process transfer and yield improvement IBM is committed to creating a diverse environment and is proud to be an equal-opportunity employer.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, gender, gender identity or expression, sexual orientation, national origin, caste, genetics, pregnancy, disability, neurodivergence, age, veteran status, or other characteristics. IBM is also committed to compliance with all fair employment practices regarding citizenship and immigration status.