Physical Hardware Engineering Director
Listed on Alphabet’s official careers site. Listed as of October 30, 2026. Check that it is still open and apply there.
Apply on Alphabet’s careers site →Job description
Minimum qualifications
Bachelor's degree in Mechanical Engineering, Product Design Engineering, Physics, a related field, or equivalent practical experience. 15 years of experience working in the computing hardware industry. 10 years of experience in technical leadership and engineering management. Experience architecting and shipping hyperscale compute, telecom infrastructure, or high-reliability physical hardware products directly to the data center.
Preferred qualifications
PhD in Mechanical Engineering, Product Design Engineering, Physics, a related field, or equivalent practical experience. Knowledge in data center hardware physical development including mechanical design, thermal management, cables/interconnects, backplanes, robotics/automation, advanced packaging, manufacturing processes, and supply chain diversification. Knowledge in mechanical and product design principles. Ability to navigate ambiguity, resolve complex technical trade-offs, and drive consensus across large, globally distributed engineering organizations.
About the job As a Director of Physical Design Engineering, you will set the technical outlook and lead the execution for our next generation of rack to chip physical solutions, and associated toolings required for its physical operations. Operating at the highest levels of technical leadership, you will be the driving force behind the integration of complex robotics, mechanical and thermal management solutions to enable Google’s ASICs, TPUs, GPUs, CPUs, storage, and advanced networking hardware into our Data Center roadmap.
In this role, you will utilize experience developing highly innovative mechanical/thermal solutions for Computing hardware systems, while delivering them at high-velocity with high quality and reliability. You will lead the team on developing a compelling roadmap, mechanical/cooling solutions from chip to boards, boards to racks and racks to data center, anticipating fleet-level challenges before they happen and leading the industry in the ongoing AI hardware physical delivery and enclosure transformation including the use of Robotics automation systems.
You will guide cross-functional teams, align external ecosystems and suppliers, and ensure our hardware scales reliably to meet the unrelenting demands of our global infrastructure. You will utilize direct deep technical expertise in physical design, significant management experience, experience delivery of complex projects and products, and ability to understand existing performance, quality, and advanced mechanical solutions manufacturing.
The AI and Infrastructure team is redefining what’s possible. We empower Google customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers include Googlers, Google Cloud customers, and billions of Google users worldwide. We're the driving force behind Google's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future.
From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Google Cloud, Google Global Networking, Data Center operations, systems research, and much more. Individual pay is determined by factors including job-related skills, experience, and relevant education or training.
US
$275000 - $382000 (USD) + 30% bonus target + equity + benefits Learn more about benefits at Google .
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