Equipment Development Engineer, Laser Alignment & Photonic Packaging

Job description

We are seeking a Senior Equipment Engineer to develop next-generation laser alignment, optical attachment, and packaging equipment for photonics applications.

Responsibilities

Design and develop precision equipment, mechanisms, fixtures, and subsystems for laser alignment, optical attachment, photonic packaging, testing, and automation applications. Translate system and process requirements into robust equipment solutions with consideration for precision, reliability, manufacturability, and cost. Design precision positioning, alignment, motion control, and opto-mechanical systems to achieve high-performance assembly and packaging processes.

Perform tolerance analysis, GD&T, and precision alignment studies to ensure system accuracy and repeatability. Develop 3D models, engineering drawings, BOMs, and technical documentation using SolidWorks. Lead prototype builds, system integration, debugging, verification, and performance optimization. Collaborate with optical, electrical, software, process, manufacturing, and quality teams to deliver complete equipment solutions.

Support supplier engagement, NPI activities, equipment qualification, and manufacturing deployment.

Qualifications

Required Master's degree or above in Mechanical Engineering, Mechatronics, Opto-Mechanical Engineering, Automation, or related disciplines. Strong experience in precision mechanical and opto-mechanical system design. Hands-on experience developing semiconductor equipment, automation systems, assembly equipment, inspection systems, or other complex electro-mechanical systems. Solid understanding of precision alignment, tolerance analysis, GD&T, materials, and manufacturing processes.

Proficiency in SolidWorks and engineering documentation. Experience in system integration, troubleshooting, root cause analysis, and engineering validation. Strong problem-solving skills and ability to work independently in a fast-paced environment. Excellent communication and teamwork skills. Preferred Experience in one or more of the following areas: Active Optical Alignment Laser Attach / Die Attach Optical Module Assembly Silicon Photonics (SiPh) Photonic Packaging Precision Motion Control & Nanopositioning Machine Vision & Optical Metrology Semiconductor Assembly Equipment