Texas Instruments · Melaka, Malaysia
Senior Wirebond Process Engineer
Listed on Texas Instruments’s official careers site. Posted October 16, 2026. Check that it is still open and apply there.
Apply on Texas Instruments’s careers site →Job description
Change the world. Love your job. Texas Instruments is looking for an energetic engineer with a passion for process. This position provides the opportunity to drive continual improvement at all levels. Our team is primarily focused on driving improved procedures and processes. We are searching for a self-directed, highly motivated engineer to join our team.
The responsibilities of a Manufacturing
- Process Engineer in this role include: Develop and implement improved methods of manufacturing, procedures, and processes that result in improved efficiencies, yields, machine operations, and quality
- Support wirebond processes for customer deliverable materials
- Document wirebond process details in specifications and work instructions
- Define applicable wirebond materials for specific applications (wire type, capillary part numbers, etc)
- Define statistical monitoring methods supporting developed wire bond processes
- Implement project or improvement plans for areas of responsibility including but not limited to: efficiency improvements, cost reduction or quality improvement programs, new product support and other process improvements
- Perform lot and equipment dispositions to support the continuous flow of production and to minimize cycle time in a high volume manufacturing 300mm wafer Fab running
Analog Technologies
- Identify systematic problems in either process or equipment related sources and communicating findings to the engineering staff in a continuous manner
- Support the manufacturing ramp with execution of equipment/process startup, process experiments (SWRs)
- Participate in data analysis and problem resolution
Qualifications
Minimum requirements
- Bachelor's degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Physics, or a related field Cumulative > 3.3 CGPA and above Experience in KNS and ASM wirebond machine in semiconductor manufacturing operations Experience in wedge bonder wirebond machine will be added advantage
- Strong foundation in statistical process control, engineering change control and process release strategies Preferred qualifications: Demonstrated strong analytical and problem solving skills
- Strong verbal and written communication skills
- Ability to work in teams and collaborate effectively with people in different functions
- Strong time management skills that enable on-time project delivery
- Demonstrated ability to build strong, influential relationships
- Ability to work effectively in a fast-paced and rapidly changing environment
- Ability to take the initiative and drive for result
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