Die Prep Equipment Engineer (MES Project)

Job description

Change the world. Love your job. Join TI as a specialized Equipment Engineer to drive the digital transformation of our Die Prep lines.

This is a unique, multi-phase role

following a 1 month TI orientation familiarizing with TI systems while being deployed into a critical MES implementation project team for 1–2 years. Upon successful project completion, you will transition into a production role, utilizing your deep MES expertise to optimize equipment uptime and automation in a high-volume manufacturing environment.

Key Responsibilities

MES Implementation (Project Phase): Represent Die Prep equipment engineering in the MES rollout. Define workflows, setup/recipe controls, and equipment states.

Integration & Data

Translate Die Prep hardware requirements (e.g., dicing/sawing mechanics) into digital designs. Define data collection points for equipment health and interlock logic.

Validation

Validate integration scenarios and support UAT and deployment.

Sustaining (Post-Project Phase)

Transition to production to maintain Die Prep equipment reliability and leverage MES data for predictive maintenance and automation.

Qualifications

Minimum Requirements

• Minimum Education (Bachelor's degree Electrical Engineering, Electrical Computer Engineering, Chemical Engineering, Mechanical Engineering, Materials Science Engineering,) Physics or related engineering degree
• Strong hands-on semiconductor equipment experience in Die Prep/Dicing equipment, with minimum
• 2 years of relevant experience Preferred Qualifications: Equipment experience with Backgrind, Mechanical Saw, Laser Saw are welcome Experience working with MES platforms , whether Siemens OpCenter or another comparable MES product modeling or configuration Working awareness of PAC-related integration and adjacent automation flows, sufficient to identify cross-system impacts and escalate early Experience on tool monitoring and interdiction software, and equipment maintenance and documentation Working knowledge of semiconductor manufacturing, and SPC techniques.

Experienced with semiconductor cleanroom protocol and behaviors.

• Strong verbal and written communication skills
• Demonstrated strong analytical, critical thinking and problem solving skills
• Ability to work in teams and collaborate effectively with people in different functions
• Ability to take the initiative and drive for results
• Strong time management skills that enable on-time project delivery
• Ability to work effectively in an interrupt-driven, fast-paced and rapidly changing environment
• Demonstrated ability to build strong, influential relationship