Staff Project/Program Management Specialist- foundry Process Technology

Job description

Within the Renesas Operations Engineering Division, we are looking for a project manager to help enable new front-end process technologies at external/internal foundries. The process technologies typically cover HV/BCD and wide bandgap technologies for power applications but can also include Mixed-Signal and RF processes. The technologies enable Renesas’ design and operation teams to develop state of the art products for some of the world’s biggest customers.

This role requires experience in project management as well as an understanding of foundry technologies and tools, semiconductor production process and the interaction with product design.

Key Responsibilities

Leadership of multi-site project teams across globe in the enablement of front-end wafer process technologies. Full project ownership and go-to person for all internal teams regarding your project Develop, maintain and execute the project plan for the enablement of new technologies. Drive project members and other contributors to meet critical milestones and customer commitment. Track and drive actions for external partners and supplies (foundries and other vendors).

Identify key risks to the program and define mitigation actions to address the risks. Track and report progress to key stakeholders (including external customers).

Qualifications

Masters/Bachelors degree in electrical engineering, materials science, or a related technical field Prior experience or training (e.g.

PMP, Prince2 etc.) in project management

• 5+ years experience in semiconductor industry, preferably in a foundry/fab
• Strong interpersonal skills; influence without authority Good written and verbal communication skills; fluency in English, Japanese and Mandarin required Additionally, following is highly desirable: Work history as a process integration engineer in a semiconductor HVM or R&D environment.

Hands-on experience with process development, technology transfer, and yield ramp. Solid fundamentals in all unit processes (litho, etch, cleans, CMP, etc.). Familiarity with GaN technologies and process flow and tools