Sr. Staff Power Module Design Engineer

Job description

We are seeking a Senior Power Module Design Engineer to own the end-to-end electrical design of high-density power modules. These products target next-generation GPU and AI accelerator core power delivery with extremely high current density, fast transient response, and tight thermal and reliability margins. This is a hands-on design role with full ownership from architecture definition through module validation.

Key Responsibilities

Design high-current, high-density power modules for CPU/GPU/xPU core power and AI server power delivery applications. Collaborate with package engineers and IC designers to develop advanced packaging solutions that integrate ICs, inductors, and capacitors into a high-density module. Conduct PDN extraction for the module package to assess power path losses and switch-node ringing. Design inductors per module and silicon pinmap.

Work with inductor vendors to bring concept designs into real products. Build and run module thermal models to ensure all components remain below maximum operating temperatures. Work with the validation team to debug power modules and perform bench characterization, including efficiency, thermal, and transient performance. Support design-for-manufacturing (DFM) and design-for-test (DFT) activities.

Qualifications

BSEE or MSEE with 5+ years of hands-on power electronics design experience. Strong experience designing high-current, high-frequency DC-DC converters, especially multiphase buck architectures. Direct experience designing power modules, VRMs, or highly integrated power solutions is strongly preferred. Deep understanding of power stage design and magnetics for high-current applications. Hands-on experience in PCB layout for high-current-density and high-frequency applications.

Proficiency with design and simulation tools

PCB layout: Cadence/Altium Designer Circuit simulation: SIMPLIS / SIMetrix PDN extraction and magnetic design: Q3D / PowerSI / Maxwell Thermal simulation: Flotherm / Icepak Proven ability to debug complex power circuits through lab measurement and root-cause analysis. Ability to collaborate effectively across IC design, packaging, reliability, and manufacturing teams.