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Renesas Electronics · Bengaluru, KA, India

Signal and Power Integrity Engineer

Bengaluru, KA, IndiaFull-timeOperations

Listed on Renesas Electronics’s official careers site. Posted September 3, 2026. Check that it is still open and apply there.

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Job description

Role Overview

We are seeking a highly skilled Signal and Power Integrity Engineer to support the design, analysis, and validation of high‑speed package and board designs. The ideal candidate will have strong fundamentals in electromagnetics and high‑speed signalling, hands‑on experience with industry‑standard simulation tools, and an ability to collaborate across silicon and systems teams to deliver robust, manufacturable products.

Key Responsibilities

Perform signal integrity (SI) and power integrity (PI) analysis for high‑speed package, PCB and system level designs. Conduct 2D and 3D EM simulations to evaluate interconnect performance to mitigate crosstalk, impedance, and loss. Analyse and optimize power distribution networks (PDN) including power plane design, decoupling strategies, and IR drop analysis. Execute frequency‑domain and time‑domain simulations for high‑speed interfaces.

Perform channel simulations and system‑level analysis using tools such as ADS and HSpice. Support design reviews, layout guidance, and ECO cycles with SI/PI recommendations. Work with validation teams to correlate simulation results with lab measurements and debug signal and power integrity issues. Develop and maintain technical documentation, reports, and presentations. Collaborate closely with PCB layout, hardware, packaging, and validation teams.

Qualifications

Strong fundamentals in electromagnetics, transmission lines, and microwave theory.

Hands‑on experience with EM simulation tools such as: ANSYS HFSS, SI-Wave, Cadence Power-SI.

Experience with circuit analysis and simulation tools

ADS, HSpice. Proficiency in handling and analysing IBIS/Spice models. Experience in power plane modelling and analysis using tools such as Power-SI, Power DC or SI-wave. Working knowledge of package and PCB technologies including stack‑up analysis, DFM, material behaviour etc. Solid understanding of high‑speed signalling in both time and frequency domains.

Nice to have

hands‑on experience with lab measurement equipment including VNA, oscilloscopes, TDR and spectrum analysers. Experience in test case development and automation using scripting languages (Python, MATLAB, or similar). Strong communication, presentation, and documentation skills with the ability to work effectively in a team environment.

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