2027研發替代役-嵌入式韌體開發

Job description

工作說明 【主要工作職責】

• Develop firmware for embedded systems, including Android/Linux BSP development, porting, and testing.
• Debug and optimize system-level interactions between MPU and MCU, including integration of third-party APIs and low-level libraries.
• Create and execute unit tests to ensure firmware robustness, addressing edge cases, system stability, and overall reliability. 【主要工作內容】
• Develop and integrate Android HAL, kernel drivers, and low-level services for SoC-based systems.
• Design and implement MCU firmware for hardware control, power management, and peripheral communication.
• Analyze and resolve firmware bugs to ensure system stability and performance on AR or wearable devices.
• Collaborate with system architects, software leads, and hardware teams to define requirements and review technical specifications.
• Explore and evaluate new technologies applicable to next-generation embedded products. 【Key Attractions】 We develop advanced smart glasses platforms and manufacture the devices locally in Taiwan.

This is a rare opportunity to take part in multiple innovative projects and products, while gaining end-to-end visibility into the entire product lifecycle - from early-stage development to full-scale mass production. Youll be working in an international, flexible, and sustainability-driven environment that fosters creativity, collaboration, and continuous growth. If youre looking for a role that balances work-life harmony with challenging, high-impact development, this is the opportunity for you. 資格需求 1. 碩士資訊工程相關科系畢業 2.

TOEIC 500+ 【Programming Language】

Preferred

• Java, C/C++

Nice to have

• Kotlin

Basic

• Python, Shell Script

Plus

• Objective-C, Swift 【Knowledge】
• Speech recognition and voice-activated processing
• Embedded Computer Vision Sensors
• Deep Learning for Image processing