Qualcomm · Hsinchu City, Taiwan

IC Packaging Substrate Engineer, up to Staff

Hsinchu City, TaiwanSenior individual contributorOperations

Listed on Qualcomm’s official careers site. Posted November 2, 2026. Check that it is still open and apply there.

Apply on Qualcomm’s careers site →

The employer’s listing has no description we could read. See it on their site.

More jobs at Qualcomm

(Structural ATPG) APAC Digital SOC Test Engineer

Hsinchu City, Taiwan

ADT System Level Test Engineer, up to Sr.

Hsinchu City, Taiwan

ASIC DV Engineer, Principal/Mgr

Hsinchu City, Taiwan

Advanced Node Process and Yield Diagnostics Engineer, Staff

Hsinchu City, Taiwan

Architecture/System Validation Engineer

Hsinchu City, Taiwan

Similar jobs at other companies

Packaging Engineer (Substrate Design and Layout)

Sandisk

Packaging Engineer (Substrate Design and Layout, Only open for fresh graduate)

Sandisk

Senior Staff Engineer Substrate Designer

Infineon Technologies · Melaka

Packaging Engineer, Substrate

Advanced Micro Devices (AMD) · Hsinchu, Taiwan

Senior Packaging Development Engineer - Substrate Modules

Texas Instruments · Melaka, Malaysia

OpenNash lists jobs from employers’ own careers sites and does not handle applications. Dates come from the employer where stated; “first seen” and “last checked” are our own observations.