Device Engineer

Job description

onsemi is seeking a highly motivated individual to join our Device Engineering / Yield Enhancement group in Gresham, OR. An Engineer in this position will work with other Engineers and Technicians in a fast-paced Silicon wafer fab production and technology development environment. Primary technology nodes range from sub-0.18um to 0.5um. Group responsibilities include Yield Enhancement (both wafer level and die level), Technology Transfers, New Product Introduction, and other production sustaining/optimization activities.

This position will build upon your Semiconductor device knowledge across the entire Silicon manufacturing chain (from bare wafers to finished goods), with a significant focus on fab manufacturability. Communication skills will be important, since this position regularly interfaces with in-house Fab Process Engineering, Technology Development, Failure Analysis, Design/Layout, wafer probe/test, in-line defect control, Quality, and Business Unit part owners and managers.

Responsibilities

Responsibilities will include one or more of the following: Yield enhancement for production products New product introduction into the Fab Scrap reduction and prevention.

• Process improvements using existing and newly acquired process equipment, often working directly with Process Engineering Minimize variation (lot to lot, wafer to wafer, product to product) Lower cost
• Improve throughput Lower defectivity Standardization / Best Known Methods
• Analyze manufacturing and test data to improve product performance
• Ensure all shipped material meets requirements
• Present trends, KPIs, and process improvements to management team

Qualifications

Qualifications

BS/MS or equivalent in Engineering, with BSEE/MSEE preferred.

Will also consider Physics, Chemistry, Chemical Engineering, Materials Engineering, or a related technical field Broad understanding of semiconductor devices, such as CMOS, DMOS, and Bipolars

• 5+ years of experience in semiconductor process technology and wafer fabrication Problem-solving mindset Comfortable using data analysis and statistics to reach conclusions Concise and clear written and oral communication skills
• Strong interpersonal skills Desired: Experience in one or more of the following engineering disciplines: Process/Device Integration, Circuit Design / Simulation, Test (parametric, circuit), Process Engineering Experience with DOE and experiment analysis
• 10+ years of experience in semiconductor process technology and wafer fabrication
• Ability to relate product circuit performance to semiconductor device parameters
• Knowledge of post-fab product manufacturing (ex: assembly, and test)
• Ability to debug issues at any point in a product manufacturing sequence Hands-on knowledge of GDS layout viewing and editing