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Nokia · United States

Process Integration Engineer

United StatesOn-siteOperations

Listed on Nokia’s official careers site. Posted August 3, 2026. Check that it is still open and apply there.

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Job description

In the position of Process Integration Engineer, you will ensure high quality and reliability of InP-based Photonic Integrated Circuit (PIC) products through extensive experiments and data analysis. You will have the opportunity to help bring up our new high-volume fab in San Jose, CA. You will work with various functional teams to troubleshoot and improve wafer fabrication processes and drive improvements in yield reliability

Responsibilities

Your Key Responsibilities

  • Troubleshoot challenging performance and yield issues in the wafer fab
  • Investigate the reason and root cause for lots being put on hold
  • Provide support for engineers with failure analysis – visual inspections, CD-SEM work, electrical IV sweeps, profilometer depth measurements, etc.

Use Manufacturing Engineering System (MES) software to help with integration engineering activities – collect data, perform basic data analysis, generate Power Point reports, etc.

Routine review of SPC charts and initial response for out-of-control events

  • Coordinate and follow movement of qual and development lots through fab, assembly, and test areas
  • Manage quality and yield of PIC wafers based on knowledge of fab processes, device physics, and the analysis of test and reliability data
  • Troubleshoot and resolve process deviations and test failures through a detailed analysis of test data and process history
  • Establish and maintain inline FAB process specifications.
  • Support
  • Process Engineering to improve process stability and capability Support Operations to improve throughput and cycle time
  • Support next-generation PIC platform development and participate in technology development, transfer, and ramp activities to meet yield, reliability and device performance goals
  • Help to assure compliance with PIC product quality system

Qualifications

Minimum Knowledge/Skills/Abilities

At least 2 years of experience working in a modern semiconductor fab which places a high premium on quality.

Understanding of semiconductor processes and device physics Understanding of statistical process control methods

  • Familiarity with or direct experience in most of the standard semiconductor process technologies required for wafer fabrication such as epitaxy, wet etching, plasma etching, metal deposition, and photolithography
  • Strong focus on quality and attention to detail Eager to learn and expand skill set
  • Strong follow-up skills and problem-solving ability and drive
  • Takes ownership for tasks and projects Team-player with good communication skills, verbal and written
  • Ability to organize data and keep track of several simultaneous projects and deadlines Education Required: B.S. or higher in Electrical Engineering, Photonics, Physics, or Materials Science with at least
  • 2 years of semiconductor fab experience.

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