Staff High-Power Laser Assembly Development Engineer

Job description

We are seeking a highly experienced Staff High-Power Laser Assembly Development Engineer to lead the development, optimization, and industrialization of advanced assembly processes for high-power semiconductor laser products. The successful candidate will play a key role in developing robust assembly solutions for InP and GaAs-based laser technologies, driving products from concept through qualification and high-volume manufacturing.

This position requires deep expertise in laser packaging and assembly, process development, automation, materials interactions, reliability, and production scaling. The role involves close collaboration with design, process, manufacturing, quality, and reliability teams to deliver industry-leading optical products.

Responsibilities

Lead the development of assembly designs and manufacturing processes for high-power InP and GaAs laser products. Drive process innovation and optimization to achieve performance, reliability, cost, and manufacturability targets. Analyze and optimize interactions between assembly materials, die attach processes, mechanical stress, thermal performance, and laser operating characteristics. Develop, evaluate, and implement assembly tooling, automation solutions, and characterization methodologies.

Perform and interpret die attach stress simulations and correlate results with product performance and reliability data. Lead failure analysis investigations and implement corrective actions to improve product robustness and yield. Support product qualification activities and establish manufacturing quality standards, process controls, and validation methods. Drive the transition of new products from development into volume manufacturing.

Collaborate with cross-functional engineering teams to address technical challenges and accelerate product development. Mentor engineers and contribute to the growth of assembly and packaging expertise within the organization.

Qualifications

Advanced degree (MS or PhD preferred) in Mechanical Engineering, Materials Engineering, Physics, Photonics, or a related discipline. 10+ years of industry experience in semiconductor laser packaging, assembly development, or a closely related field. Proven expertise in assembly design and process development for high-power InP and/or GaAs laser products. Deep understanding of material interactions, die attach processes, mechanical stress mechanisms, thermal management, stability, and their impact on laser performance.

Hands-on experience with assembly tooling, automation systems, characterization techniques, manufacturing process development, and failure analysis methodologies. Experience performing or interpreting die attach stress simulations and related modeling activities. Demonstrated track record of successful product development leading to qualification, volume production, manufacturing scale-up, and automation. Strong knowledge of manufacturing quality systems, process controls, and reliability standards.

Preferred Qualifications

Experience supporting high-volume optical component manufacturing environments. Knowledge of semiconductor packaging reliability testing and qualification methodologies. Familiarity with statistical analysis and process improvement methodologies. Experience working in multidisciplinary photonics or optical networking organizations.

What We Are Looking For

Strong communication and collaboration skills with the ability to work effectively across global teams. Self-motivated individual with a strong sense of ownership and accountability. Proven ability to solve complex technical problems and deliver results in a fast-paced environment. Passion for innovation and continuous improvement.