MediaTek · HsinChu
3DIC Advance Package Design Engineer
Listed on MediaTek’s official careers site. Listed as of October 23, 2026. Check that it is still open and apply there.
Apply on MediaTek’s careers site →Job description
- Contribute to the development and enhancement of design methodologies for 2.5D and 3D IC advanced package design.
- Lead the development of new design and signoff flows for physical, electrical, and thermal quality assurance.
- Support package design teams in defining a tool roadmap for advanced package design.
- Contribute to interposer designs, advanced package designs, and test vehicles for the product design roadmap and feasibility.
- Represent the Package design team in customer engagements for advanced package designs. #LI-JK1
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