Lead Principal Engineer Technology Integration

Job description

Lead Package Business Case (PBC) and Technology Project Case (TPC) assessments, providing technical evaluations, integration readiness assessments, and risk mitigation recommendations. Drive Package Technology Design Failure Mode and Effects Analysis (DFMEA) activities to systematically identify, assess, and mitigate technology and process-related risks. Own and lead risk interaction assessment and mitigation work packages, ensuring potential process and material interactions are identified and addressed early in development.

Drive the integration of unit processes, Bills of Materials (BOM), and process flows within package platforms, including interaction studies, process compatibility assessments, and manufacturing risk evaluations. Act as the key technical partner for Front-End (FE) and Back-End (BE) integration activities, supporting FE/BE and BE/BE interaction topics throughout product and technology development. Support pre-development initiatives for emerging chip and package technologies through feasibility assessments, technology evaluations, and integration studies.

Lead or contribute to structured problem-solving activities using methodologies such as 8D, Fishbone Analysis, Fault Tree Analysis (FTA), and Root Cause Analysis (RCA) to resolve technology interaction issues. Assess the impact of package design rules and process requirements on inter-process interactions, product performance, manufacturability, and reliability. Provide subject matter expertise, technical guidance, and mentorship to project teams on technology integration, process interactions, and risk management topics.

Collaborate with development, process engineering, reliability, assembly, test, and manufacturing teams to ensure successful implementation of advanced package technologies. Bachelor's Degree in Engineering, Materials Science, Microelectronics, Semiconductor Technology, Mechanical Engineering, Electrical Engineering, Electronics Engineering, Physics, or a related discipline. Minimum 5 years of experience in semiconductor manufacturing, package development, technology integration, assembly, SMT, or related engineering functions.

Strong knowledge of Semiconductor Packaging, Surface Mount Technology (SMT), assembly processes, and technology integration principles. Proven experience in technical problem-solving and root cause analysis within semiconductor manufacturing or advanced packaging environments. Solid understanding of process interactions, material compatibility, manufacturing risks, and technology qualification methodologies. Strong communication, collaboration, and stakeholder management skills with the ability to influence decisions across multidisciplinary teams.

We are on a journey to create the best Infineon for everyone. We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity. Our hiring decisions are based on skills and experience. Even if you don't meet every requirement, we encourage you to apply. Please let your recruiter know if you need any accommodations during the interview process.

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