(16)【2026新幹班】機構/熱傳類 Mechanical/Thermal

Job description

Responsibilities 協助高密度伺服器機櫃與電子產品的結構強度分析與散熱方案設計；參與熱源模型建立與 CFD 流體力學模擬分析驗證。配合團隊規劃溫升、風洞與噪音實測計畫，協助執行新材料的選用評估與 Mockup 樣品之組裝性能解析，學習極致散熱解決方案。 Assist in structural strength analysis and thermal design for high-density server racks and electronic products. Participate in thermal model building and CFD simulation validation. Support temperature rise, wind tunnel, and noise testing. Assist in evaluating new materials and analyzing mockup assembly performance.

Requirements 初步掌握 3D CAD (Creo/SOLIDWORKS) 與熱流模擬軟體 (FloTHERM)；對機械結構動靜態分析與材料力學有紮實基礎學能。 Basic mastery of 3D CAD and thermal simulation software (FloTHERM). Solid academic foundation in structural analysis and mechanics of materials.

需求系所 (Preferred Majors)

機械工程、航太工程、熱傳學門、材料科學 (Mechanical, Aerospace, Thermal, Materials)