Wafer Bonding Process Engineer, Quantum AI

Job description

Minimum qualifications

Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a specialized field (e.g., Optics, Sensors, Audio/DSP, etc.), or equivalent practical experience. 3 years of experience developing, sustaining, or integrating semiconductor fabrication processes in an research and development (R&D) or cleanroom production environment. 3 years of experience in temporary wafer bonding, laser/thermal debonding, thin wafer handling, or back-end packaging processes.

Preferred qualifications

Master's degree or PhD in Electrical Engineering, Computer Engineering, Physics, or a related field (e.g., Optics, Sensors, Audio/DSP). Experience mitigating mechanical stress, bow, warp, and micro-cracking in ultra-thin silicon substrates, integrated with backside thinning and dicing-on-tape workflows. Experience executing 3D Integration technical roadmaps, executing complex development and process integration projects.

Excellent collaborative leadership skills, and experience leading technical evaluations with equipment vendors, managing joint development projects, and cross-training/mentoring engineers and technicians. Expertise in polymer adhesives, temporary bonding materials, and release processes. Ownership qualifying automated temporary bonding, lamination, and laser/mechanical debonding tools. About the job Google Quantum AI is building quantum computing for otherwise unsolvable problems.

The full potential of quantum computing will be unlocked with a large-scale computer capable of complex, error-corrected computations. Our roadmap is focused on advancing the capabilities of quantum computing and enabling meaningful applications. In this role, you will lead the development, integration, and Release to Production of temporary wafer bonding, thinning, and debonding (TB/DB) processes for Google Quantum AI’s next-generation quantum processors.

Responsibilities include developing and implementing process flows featuring advanced adhesive bonding chemistries, manufacturable debonding systems, and thin-wafer handling. You will partner with equipment vendors and cleanroom module owners to bring up automated bonding and debonding equipment, coordinate evaluation runs, and transition validated processes into baseline process flows for upcoming milestones. You will establish robust process controls to mitigate wafer stress, bow, warp, and other downstream process integration issues across ultra-thin substrates.

Individual pay is determined by factors including job-related skills, experience, and relevant education or training.

US

$159000 - $230000 (USD) + 15% bonus target + equity + benefits Learn more about benefits at Google .