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Western Digital

Intern - Technologist, Hardware Development Engineering (Studying Ph.D Degree)

BangPa-in, PHRA NAKHON SI AYUTTHAYA, ThailandInternship or early careerEarly careerOperations

Listed on Western Digital’s official careers site. Posted September 14, 2026. Check that it is still open and apply there.

Apply on Western Digital’s careers site →

Job description

ESSENTIAL DUTIES

AND RESPONSIBILITIES: The Technical PhD Intern will support machining and lapping process development for next-generation wafer technologies. The role offers hands-on experience applying modeling, simulation, data analytics, AI/ML, software, and hardware development to improve process capability, quality, and manufacturing performance. Support machining and lapping process development projects. Develop and apply modeling and simulation methods to understand process behavior.

Analyze process and equipment data using statistical and AI/ML techniques. Assist in developing software tools, algorithms, and engineering analytics solutions. Support experimental design, process characterization, and root cause investigations. Collaborate with process, equipment, software, and data engineering teams. Document and present technical findings and recommendations.

Qualifications

REQUIRED

Currently pursuing a PhD degree in Mechanical Engineering, Materials Science, Electrical Engineering, Computer Engineering, Physics, Data Science , or equivalent experience Internship period must be at least 4 months; can be on-site at Bangpa-in, Ayutthaya PREFERRED: Research experience in machining, lapping, precision engineering, manufacturing processes, or advanced materials . Knowledge of Design of Experiments (DOE), statistical analysis, and process optimization.

Familiarity with sensor systems, automation, or hardware development.

SKILLS

Experience in modeling, simulation, data analysis, or computational research. Experience with AI/ML, data analytics, or predictive modeling Programming experience in Python, MATLAB, C/C++, or similar. Strong analytical, problem-solving, teamwork, and communication skills. Strong with Root Cause Analysis and Technical Communication Strong written and verbal English communication

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