Thin Film Processing Engineer
Listed on Western Digital’s official careers site. Posted August 13, 2026. Check that it is still open and apply there.
Apply on Western Digital’s careers site →Job description
Responsible for sustaining the vacuum thin film deposition using PVD/IBD processes, and characterize thin film properties, such as XRF, XRR, TEM, BH-Looper, and other magnetic properties. Responsible to analyze the wafer processing and probing results. To correlate the wafer probing results to wafer individual processing steps and materials to create action items and recommendations to resolve the production yield and quality issues.
To perform and/or coordinate wafer level failure analysis activities related to reader thin film deposition processes, such as TEM analysis, wafer level SPC audit to identify possible root causes for all released products. Work with advanced reader development group to transfer new deposition processes into production as well as qualify new tools.
Qualifications
BS or MS Degree in Engineering, Physics, Materials Science or a related field. Good communication skills 2 yrs of thin film deposition related work experience preferred Magnetic background preferred. Strong statistical data analysis skills are preferred.
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