DCP- Electronics HW Engineer(Global)-SZ

Job description

Senior Power Electronics Engineer (Shenzhen) Location

Shenzhen, China Company : Foreign-invested enterprise Responsibilities Power Electronics Product Development Lead the design and development of power electronics products, such as inverters, converters, charging modules, and power management systems. Responsible for topology design, component selection, magnetic component design, and thermal design to ensure system performance and reliability. Technical Verification & Testing Plan and perform electrical performance, safety, and EMC tests; drive prototype validation and functional debugging.

Analyze and resolve technical issues related to electrical design, thermal management, and EMI/EMC during the development process. Project Management & Cross-functional Collaboration Participate in project initiation and technical evaluation, define development plans, and ensure on-time delivery. Collaborate closely with global R&D teams, suppliers, and manufacturing teams to support the entire product lifecycle from R&D to mass production.

Standards & Compliance Ensure designs comply with international and domestic standards (e.g., IEC, UL, GB). Stay up to date with industry trends, advanced technologies, and new components in the field of power electronics, and apply them to product development. Team Support & Guidance Provide technical coaching and training to junior and mid-level engineers. Participate in technical reviews and intellectual property development (e.g., patents), contributing to overall R&D capability enhancement.

Qualifications

Master’s degree or above in Power Electronics, Electrical Engineering, Automation, or related fields. 5+ years of experience in power electronics product development; background in high-power supplies, PV/storage inverters, EV chargers, or automotive powertrain electronics is a plus. Solid knowledge of common power electronics topologies (e.g., Buck/Boost, LLC, Full-Bridge, Three-Level). Skilled in magnetic component design and thermal simulation.

Proficient in applying and driving power devices (IGBT, SiC, GaN). Strong English communication skills, capable of working effectively with overseas R&D teams. Excellent problem-solving, analytical, and innovative thinking skills.