Career Accelerator Program - Reliability Engineer
Listed on Texas Instruments’s official careers site. Posted September 25, 2026. Check that it is still open and apply there.
Apply on Texas Instruments’s careers site →Job description
Change the world. Love your job. In your first year with TI, you will participate in the Career Accelerator Program (CAP), which provides professional and technical training and resources to accelerate your ramp into TI, and set you up for long-term career success. Within this program, we also offer function-specific technical training and on-the-job learning opportunities that will encourage you to solve problems through a variety of hands-on, meaningful experiences from your very first day on the job.
The TMG Development program is a 12-month program for new college graduates in the TMG organization. Texas Instruments is actively seeking a Reliability Engineer to join our team. Put your talent to work with us! This role is pivotal in driving reliability performance across the entire product lifecycle, from initial development to end-of-life. For new product introductions, the successful candidate will collaborate with technology, packaging, and development teams to assess product quality and long-term reliability.
By working closely with business units, you will evaluate how designs, materials, and manufacturing processes impact both product launch and sustained field performance. This involves defining requirements for components and systems, validating them through rigorous reliability testing, and recommending optimizations in component selection. Furthermore, you will champion best engineering practices, advanced statistical process controls, and innovative tools, including AI and new reliability acceleration techniques, to proactively identify potential product or process failures.
Through cross-functional collaboration, you will ensure all products meet or exceed company, customer, and industry reliability standards.
Qualifications
Minimum requirements
PhD in Electrical Engineering or related degree Cumulative 3.0/4.0 GPA or higher Preferred qualifications: Expertise in semiconductor/packaging reliability, failure mechanisms, and industry standards (AEC, JEDEC). Strong problem-solving skills with a focus on data-driven decision-making and technical communication. Proven ability to manage complex projects, drive results, and meet strict deadlines in an autonomous environment.
Excellent interpersonal skills with a track record of building strategic relationships across internal functions and external partners. Ability to quickly master new systems, tools, and technical processes.
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