Principal Digital Design Engineer

Job description

Renesas is a global semiconductor company providing hardware and software solutions for various cutting-edge technologies including self-driving cars, robots, automated factory equipment, and smart home applications. We are a key supplier to the world's leading manufacturers of electronics you rely on every day; you may not see our products, but they are all around you. Renesas is a global, multi-billion dollar, a publicly traded company headquartered in Japan, and has subsidiaries in 20 countries worldwide.

Renesas is a dynamic, multicultural technology company where employees learn, mentor, innovate and thrive. Renesas is extending our share in fast-growing data economy-related markets such as infrastructure and data centers and strengthening our presence in the industrial/IoT and automotive segments. Our solutions drive products developed by major innovators around the world. Join us and build your future by being part of what's next in electronics.

This is a Principal Digital Engineer position for a qualified individual to work in Renesas' Analog and Mixed Signal Business Group. The primary role is to architect, design and implement the digital and mixed signal IC. The candidate will work together with the team in the other sites of United State and the team in China and contribute to all aspects of development from product conception to production release. The Candidate should have experience in architecting and leading the development, with a proven track record of delivering high-quality silicon on time and within cost targets.

The candidate will also be responsible for design documentation, silicon evaluation, circuit debugging, production test development support, and customer and applications support. He/she will also be involved in the specification of technology requirements for future products.

Qualifications

Education

MSEE or PH.D. in Electrical Engineering with 8+ years of relevant industry experience, or BSEE in Electrical Engineering with 12+ years of relevant industry experience Proven experience in SOC architecture, AHB/APB/AXI, bus matrix and interface protocols – USB, I2C/I3C, SPI, UART; packet-oriented protocols. Good knowledge of embedded memories – SRAM, OTP, MTP and EE/Flash memory

Good knowledge of design flow. Hands on in chip architecture definition, Partition, assignment, RTL coding, simulation, synthesis, DFT and timing check Strong Communication and Teamwork Skills Highly Motivated and Creative Individuals AI Savvy and leveraging AI in daily work Bilingual and Mandarin fluency would be a plus DDR DRAM and

Flash memory knowledge would be a plus Mixed signal knowledge and mixed-signal chip development experience is highly preferred.

Project management skills are highly preferred