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Renesas Electronics · Tempe, AZ

Module Product Engineer

Tempe, AZ, United StatesFull-timeOperations

Listed on Renesas Electronics’s official careers site. Posted September 16, 2026. Check that it is still open and apply there.

Apply on Renesas Electronics’s careers site →

Job description

HYBRID Applicants for this position must be currently authorized to work in the United States on a full-time basis. Renesas is unable to sponsor applicants for work visas for this position now or in the future. Seeking an experienced Product Engineer (PE) to own the technical readiness, manufacturability, and lifecycle performance of advanced power modules from New Product Introduction (NPI) through high-volume production and sustaining.

This role is accountable for end-to-end product execution across design, test, quality, assembly, and manufacturing to deliver performance, quality, cost, and schedule targets at scale. Renesas Electronics, a leading global semiconductor company, is rapidly scaling its AI-focused power delivery business. Products include high-performance digital power VRMs, multiphase controllers, Smart Power Stages (SPS), Vertical Power Stages (SPS with integrated capacitors and multiple silicon die), Power Towers (power modules integrating multiple SPS-equivalents with capacitors and inductors), and power MOSFETs.

Key Responsibilities

  • Own product engineering execution for advanced power modules from NPI through high-volume production and sustaining
  • Own the manufacturability of advanced power modules, driving robust assembly processes across OSAT and internal manufacturing sites
  • Establish and enforce assembly workmanship standards, ensuring compliance with IPC-A-610 (Acceptability of Electronic Assemblies)
  • Drive cross-functional alignment across Design, Test, Quality, and Manufacturing to enable scalable, high-yield module production
  • Lead resolution of assembly-related excursions, including die attach, clip attach, solder integrity, and module-level defects
  • Lead product bring-up, characterization, and silicon readiness in partnership with Design, Test, and Applications teams
  • Define and maintain product specifications, limits, and guard-bands based on silicon behavior and manufacturing capability
  • Lead yield analysis, parametric trend monitoring, and root-cause investigations
  • Drive cost, yield, and cycle-time improvement through data-driven analysis
  • Own manufacturing release, qualification execution, and product change management (PCNs)
  • Serve as the technical escalation owner for production issues, customer returns, and corrective actions
  • Support critical customer engagements on product, quality, and manufacturing topics as needed

Qualifications

Education

Bachelor’s degree required in Electrical Engineering, Computer Engineering, or a related field; master’s degree in a relevant engineering discipline preferred. Mechanical Engineering degree preferred, particularly for roles involving module packaging, thermomechanical behavior, and assembly optimization.

Experience & Skills

Applicants for this position must be currently authorized to work in the United States on a full-time basis.

Renesas is unable to sponsor applicants for work visas for this position now or in the future. 8+ years of experience in semiconductor product engineering, manufacturing engineering, or test engineering, with demonstrated ownership from NPI through high-volume production

  • Strong technical depth in semiconductor power products and advanced power module manufacturing
  • Strong data analysis skills with the ability to interpret statistical results and drive decisions Working knowledge of new product development, qualification, and high-volume manufacturing transfer
  • Strong written and verbal communication skills with customers and cross-functional teams
  • Proven ability to lead complex technical decisions, escalations, and execution across organizations

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