Mid-end and backend process technology (WET/Integration/Metal deposition/Lithography engineer)

Job description

SPS (Smart Power Stage) products are expected to see significant demand growth from 2025 to 2030, with a particular surge in demand for AI servers. These devices, especially embedded VPS such as PT (Power Tower Module) and VPS (Vertical Power Stage), require Mid-end processes such as Cu-RDL, backside metal, and ultra-thinning of Si, which also help differentiate from competitors. Renesas is strengthening in-house manufacturing, and as part of this, we plan to develop technologies for these Mid-end processes, secure production capacity and shorten LT through in-house production.

These in-house productions are also strongly requested by customers. Going forward, chiplet technology that maximizes performance while reducing manufacturing costs and shortening development periods will increasingly require Mid-end processes such as RDL and bumps. This time, we are recruiting personnel who understand the structure and characteristics of power devices and can build optimal processes from Mid-end processes such as RDL and OPM to back-side processes and dicing, as we internalize embedded VPS.

By acquiring personnel well-versed in Mid-end and backside processes, it becomes possible not only to develop internal processes but also to respond to issues in OSAT.

We are seeking process engineers in the following four areas: 【Roles and Responsibilities】 ①WET process engineer Promotion of WET process development for Mid-end and backend processes of new products Technical responses and reporting based on WET process development

• Support for manufacturing line startup and mass production transition Promotion of product quality and yield improvement activities
• Support for technology development of new materials and new manufacturing methods related to WET process
• Support for cost reduction activities in traditional WET processes ②Integration engineer Promoting process development for Mid-end and backend processing of new products Technical responses and reporting based on process development
• Support for technology development of new materials and new manufacture development
• Support for cost reduction activities in conventional processes ③Metal deposition engineer Promotion of metal deposition process development for intermediate and backend processes of new products Technical responses and reporting based on metal deposition process development
• Support for technology development of new materials and new manufacturing methods related to metal deposition process
• Support for cost reduction activities in traditional metal deposition processes ④Lithography engineer Promotion of lithography process development for Mid-end and backend processing of new products Technical responses and reporting based on lithography process development
• Support for technology development of new materials and new manufacturing methods related to lithography
• Support for cost reduction activities in traditional lithography-related processes

Qualifications

①WET process engineer Required: Over 2 years of experience in WET process development or mass production Experience in developing or evaluating WET process-related materials Experience in developing or evaluating WET process-related equipment Degree in engineering (mechanical, materials, electronics, chemistry, etc.)

Preferred

Basic knowledge of power devices

• Knowledge of reliability testing evaluation Practical experience in process improvement and quality control Experience in complying with quality standards such as ISO/IATF ②Integration engineer Required: Over
• 2 years of experience in semiconductor integration development after metallization Basic knowledge of power devices
• Knowledge of reliability testing evaluation Practical experience in process improvement and quality control Degree in engineering (mechanical, materials, electronics, chemistry, etc.)

Experience in semiconductor package development Development experience in wafer process technology startup Experience in complying with quality standards such as ISO/IATF ③Metal deposition engineer Required: Over 2 years of experience in semiconductor metal deposition process development or mass production Experience in developing or evaluating metal deposition-related materials Experience in developing or evaluating metal deposition-related equipment Degree in engineering (mechanical, materials, electronics, chemistry, etc.)

Basic knowledge of power devices

• Knowledge of reliability testing evaluation Practical experience in process improvement and quality control Experience in complying with quality standards such as ISO/IATF ④Lithography engineer Required: Over
• 2 years of experience in semiconductor lithography technology development or mass production Experience in developing or evaluating lithography-related materials Experience in developing or evaluating lithography-related equipment Degree in engineering (mechanical, materials, electronics, chemistry, etc.)

Basic knowledge of power devices Knowledge of reliability testing evaluation Practical experience in process improvement and quality control Experience in complying with quality standards such as ISO/IATF