Sr Prcess Engineer工艺工程师

Job description

Key Responsibilities

• Take on wire bonding (WB) process development for new products and packages (e.g., Cu/Au wire), including establishing process window and bonding conditions independently.
• Drive NPI activities covering development validation, data analysis, yield improvement, SPC and reporting.
• Perform trouble shooting and drive continuous quality improvement and process stabilization.
• Manage new material introduction (e.g., bonding wire, lead frame, substrate, plating solution, capillary) and optimize process parameters to improve productivity and reduce cost.
• Define and maintain WB process specifications, standard procedures and support reliability evaluation and risk assessment.
• Understand equipment and tooling principles and continuously optimize related specifications and configurations.

Qualifications

- Bachelor’s degree or above in Engineering or related fields.

• At least 3 years of experience in semiconductor manufacturing (e.g. QFP, BGA) is preferred.
• Experience in process engineering or equipment engineering is a plus.
• Familiar with WB process, NPI workflow and data analysis.
• Proficient in MS Office (Excel, PowerPoint, Word).
• Good communication and teamwork skills. - CET6 and above, working level in English.