Process Engineer

Job description

We are seeking a Process Engineer with a minimum of 2 years of hands-on experience in semiconductor back-end assembly processes , particularly die bonding and wire bonding . The successful candidate will be responsible for process setup, optimization, yield improvement, and troubleshooting to ensure stable and high-quality manufacturing performance. The role requires strong technical understanding of back-end equipment, materials, and process interactions, as well as the ability to analyze data, drive continuous improvement, and support production operations.

Key Responsibilities

• Develop, optimize, and sustain die bond and wire bond processes to meet quality, yield, and reliability requirements
• Perform process troubleshooting and root cause analysis for yield loss, defects, and equipment issues
• Support new product introduction (NPI), process qualification, and transfer to mass production
• Establish and maintain process parameters, work instructions, and control plans
• Analyze process data using statistical methods (e.g.

SPC, CPK, trend analysis) Collaborate with cross-functional teams including Production, Quality, Equipment, and R&D Drive continuous improvement activities for cost, yield, cycle time, and reliability

Qualifications

• Bachelor’s degree in Engineering (Materials, Mechanical, or related field) Minimum
• 2 years of experience in semiconductor back-end assembly
• Strong knowledge of die bonding and wire bonding processes
• Familiarity with back-end materials such as leadframes, substrates, adhesives, and bonding wires Experience with process characterization, DOE, and data analysis is an advantage Good problem-solving, communication, and teamwork skills.

Additional Advantage

Experience with QFN, or similar packages is added advantage. Knowledge of yield improvement, reliability testing, and failure analysis Exposure to automation, equipment setup, and process optimization