Semiconductor Package Electrical Design Engineer

Job description

• Lead semiconductor package design in collaboration with IC design engineers to optimize product cost and performance.
• Lead the layout design of package substrates and printed circuit boards for reference designs for semiconductor products incorporating high-speed memory interfaces and high-speed serial communication circuits.
• Investigate technology trends in semiconductor packages and printed circuit boards, and propose and develop design technologies required for next-generation products.
• Take on a leadership role within the design team as your experience grows.

Qualifications

【MUST】

• Ability to understand the Renesas Culture principles of Transparent, Agile, Global, Innovative, and Entrepreneurial, and act in accordance with these values
• At least three years of practical experience in semiconductor package design
• At least three years of practical experience in high-speed or high-frequency electrical design 【WANT】
• At least three years of practical experience in semiconductor package design at a semiconductor manufacturer
• At least three years of experience using electromagnetic field simulation tools such as HFSS and Q3D
• At least three years of experience using high-frequency circuit simulation tools such as ADS and HSPICE
• At least three years of experience in electrical characterization using VNAs, impedance analyzers, or similar equipment, or in EMC evaluation