Sr Staff Engineer

Job description

• Package Development & NPI Support
• Support package development activities for new Power MOSFET products including: TOLL / TOLG / TOLT Bottom-side cooled (BSC) Dual-side cooled (DSC) Top-side cooled (TSC) . Advanced lead frame and clip-bond packages
• Define package requirements and specifications for new product development.
• Support package qualification and AEC-Q101 compliance activities.
• Drive package-related activities during NPI and product transition.
• Thermal & Mechanical Engineering
• Perform thermal analysis and package characterization.
• Conduct thermal resistance and thermal impedance measurements.
• Evaluate package reliability associated with: Power cycling Thermal cycling Solder joint reliability Mechanical stress
• Support package-level failure analysis and root cause investigation.
• Package Benchmarking & Technology Survey
• Benchmark competitor power package technologies.
• Analyze package construction, materials, and performance.
• Identify technology trends and recommend future package roadmaps.
• Conduct package reverse engineering and technical assessments.
• Simulation & Modeling
• Develop and maintain thermal simulation models.
• Support electrical and mechanical package simulations.
• Correlate simulation results with measurement data.
• Collaborate with system engineers on thermal optimization and system-level performance evaluation.
• Product & Customer Support

Support customer inquiries regarding

• Thermal performance Package selection Reliability considerations
• Work with Application Engineering teams on customer design support.
• Develop package-related technical documentation and application notes.
• Cross-Functional Collaboration
• Coordinate package activities with: Design Engineering Product Engineering Reliability Engineering Manufacturing Marketing External package suppliers
• Participate in product definition reviews and technical decision-making.

Qualifications

【MUST】 Thermal characterization and analysis Semiconductor package design fundamentals Reliability testing and qualification. Failure analysis techniques. Statistical data analysis. PCB and thermal design knowledge. 【WANT】 Thermal simulation tools: ANSYS Icepak ANSYS Mechanical FloTHERM Familiarity with: Automotive semiconductor requirements AEC-Q101 APQP/PPAP