Senior Equipment Engineer (Wire Bond)

Job description

Responsible for driving wire bonding equipment performance and reliability to meet production targets. The role focuses on improving Overall Equipment Effectiveness (OEE), and minimizing unplanned downtime (UDT). This includes planning maintenance strategies, leading troubleshooting activities, and collaborating cross-functionally to ensure stable and efficient equipment operation.

Key Responsibilities

• Drive and improve equipment performance metrics (OEE, MTBC, UDT)
• Lead troubleshooting and root cause analysis for equipment-related issues
• Plan and optimize preventive maintenance strategies and schedules
• Monitor equipment performance trends and drive improvement initiatives
• Collaborate with production, process, and vendors to implement effective solutions
• Coach and guide technicians on technical problem-solving and best practices

Qualifications

• Bachelor’s Degree in Engineering (Mechanical / Electrical / Mechatronics / Manufacturing) Minimum 6 years’ experience in semiconductor equipment maintenance (wire bond preferred)
• Strong troubleshooting and root cause analysis capability
• Solid understanding of equipment performance metrics (OEE, MTBC, downtime analysis) Good leadership and cross-functional communication skills Good to have Experience with wire bonding equipment (E.g.

Shinkawa UTCx000 series, K&S Iconn) Familiar with structured problem-solving methodologies Experience in equipment reliability and optimization projects Hands-on experience in equipment troubleshooting and validation

• Ability to prepare clear, structured, and comprehensive technical reports
• Knowledge in automation, vision systems, and predictive maintenance approaches