Staff -Principal Engineer of External Manufacturing Operation Engineering

Job description

This position, based in the Philippines, is responsible for driving continuous improvement in package quality, manufacturing processes, operational efficiency, and system robustness at external subcontractors for ON Semiconductor (Onsemi). This requires close collaboration with internal stakeholders and subcontractor teams to execute the following responsibilities:

Responsibilities

Core Responsibilities

Lead task force initiatives focused on process and quality improvements. Ensure process robustness and risk mitigation across subcontractor operations. Manage change control processes, including risk assessments and mitigation strategies. Serve as the communication bridge between Business Units (BU), customers, and project teams for program updates. Support quality objectives and drive EFAR reduction efforts. Investigate EFAR and SQIN issues, implement root cause analysis, and establish corrective and preventive actions.

Deploy and scale Best Known Methods (BKMs) across sites. Facilitate and support customer and subcontractor audits. Manage daily subcontractor operations with a strong onsite presence.

Additional Responsibilities

Drive continuous improvement initiatives targeting yield enhancement and process line drift reduction. Lead operational improvement projects focused on quality, process, delivery, and cost optimization. Provide production support, including maverick material verification (MRB) and disposition. Execute qualification activities for change management projects involving products, assembly/ test processes, equipment, and systems.

Qualifications

Qualifications

Bachelor’s degree in engineering. Minimum of 12 years of experience in semiconductor assembly, with a focus on Process or Quality Engineering for automotive-grade products. (Power IC is plus) Positive and proactive attitude toward challenges and continuous learning for all critical issues. Willingness and ability to work onsite at subcontractor locations. Demonstrated leadership in troubleshooting and structured problem-solving (e.g., 8D, Is-Is Not, 3-5 Why).

Certifications in VDA or IATF16949 are highly preferred. Excellent communication skills in English, with the ability to engage effectively with global teams and customers. Success Factors Self-motivated and capable of working independently and planning. Strong technical knowledge of semiconductor packaging and assembly processes. (E.g., Wire bond base for Ag, Au, Cu, and Al wires) Proven ability to collaborate effectively across cross-functional teams.