Engr I, Process; MFG (Backend)
Listed on ON Semiconductor ’s official careers site. Posted September 24, 2026. Check that it is still open and apply there.
Apply on ON Semiconductor ’s careers site →Job description
Responsible for developing, sustaining, and improving QFN molding processes to achieve optimum product quality, manufacturing efficiency, yield, reliability, and cost performance. The engineer will lead process troubleshooting, continuous improvement activities, and new package/product qualifications related to mold operations.
Responsibilities
Responsibilities of QFN Mold Engineer Own and sustain QFN molding processes to ensure stable production, high yield, and product quality. Monitor and improve molding KPIs including yield, scrap rate, machine utilization, and cycle time. Perform troubleshooting and root cause analysis for molding-related issues such as warpage, delamination, voids, package crack, mold flash, incomplete fill, and wire sweep. Lead process optimization activities through DOE, statistical analysis, and continuous improvement methodologies.
Develop and maintain process specifications, OCAP, control plans, and engineering documentation. Support new product introduction (NPI), package qualification, and material evaluations. Drive yield improvement and cost reduction projects to enhance manufacturing performance. Collaborate with Production, Quality, Equipment, and Maintenance teams to resolve process and equipment issues. Review and qualify molding materials, tooling, and process changes.
Analyze process data and implement corrective and preventive actions (CAPA) to improve reliability and quality. Provide technical coaching and guidance to technicians and operators. Support customer audits, internal audits, and quality improvement initiatives. Ensure compliance with safety, quality, and manufacturing standards.
Qualifications
degree holder in engineering field in Mechanical, electrical, mechatronics and materials
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