External Manufacturing NPI Engineer (Assembly Packaging)

Job description

We are looking for a skilled NPI Engineer (Assembly Packaging) to join our External Manufacturing team to drive our growing NPI/ NPD portfolio, especially new tactical engagements critical for onsemi's business growth. In this role, you will leverage your strong expertise and extensive technical network to drive new production introduction, develop new capability requirements, shape manufacturing strategies, and deliver advanced solutions for next-generation silicon technology and packaging solutions.

Responsibilities

Own backend external manufacturing NPI from conceptualization, development, qualification to production launch with a focus on wafer-level packaging (WLP) and post-fab solutions Functional Leadership for NPI to deliver PLM requirements for new product commercialization and to co-work with cross functional team (comprising both internal and external stakeholders) to achieve on-time market release Drive DFM, technology & manufacturability readiness for new product/ package development, effective POR freeze for new product introduction Partner with OSATs to deliver assembly readiness for new product qualification.

Key activities include BOM & process setup, risk analysis & mitigation, process characterization, lookahead assessment, qualification and CAB preparation leading to first part release

• Manage production ramp: lead production safe launch, provide technical support to resolve ramp issues, develop CIP, set production baseline for transition into HVM Collaborate with internal & external partners for technology pathfinding, package roadmap as well as design rules/ guideline development Adoption of data analytics and data-driven approach to problem solving and decision making Establish Best Known Methods (BKM) and Best-in-Class practices for new package platform and fan-out to production
• Participate in quality and process readiness audit to achieve production site readiness Co-work with operations to drive continuous yield improvement for evolving challenges Subject Matter Expert to address arising package and assembly challenges Experienced candidate(s) will be considered for technical lead role to manage team activities

Qualifications

• Bachelor's Degree in Engineering/ Materials Science or equivalent technical background More than
• 10 years of experience in backend semiconductor IC manufacturing environment, with in-depth assembly process expertise and shop floor experience Hands-on experience in wafer-level packaging (WLP), bumping and post-fab solutions including electroless & electrolytic plating and other surface finishing technology will be advantageous Familiar with plating chemistry/ process and material/ metallurgy characterization & microstructural analysis Exposure to power device technologies (SiC, JFET, GaN, IGBT, Hybrid etc) Prior experience in NPI, product/ process integration and familiar with Chip-to-Package Interaction (CPI) effect Experience in IC package design/ CAD/ FEA simulation/ characterization will be advantageous Good overall understanding of OSAT business landscape and operations Adept at cross-functional collaboration, Adaptable to matrix organization, strong engineering fundamentals (including DOE characterization, SPC, failure analysis) and problem-solving skills
• Strong project management skills and multi-stakeholder management
• Proficient in statistical analysis methods and familiar with data analytics Good communication skills and proficient in written & spoken English.

Spoken proficiency in Mandarin will be advantageous