Post Fab Module Engineer

Job description

We are seeking a highly motivated and experienced semiconductor Senior Module Engineer to join our growing 300mm Post Fab team in East Fishkill, NY. This role is critical to our ability to improve manufacturing performance and drive best in class Quality, Cycle-time, and Cost as we develop new products and ramp volume manufacturing. Job role requires an Engineer who is experienced in semiconductor high volume manufacturing and is ready to take a leadership role on our Module Engineering Team.

Responsibilities

Key Duties and Responsibilities

Owns multiple toolsets in Post Fab; including tactical performance and improvement roadmap for the equipment and process in manufacturing on these toolsets. Develop new process and own controls and scaling to high volume manufacturing. Evaluate and qualify new materials, processes, and equipment for our Post Fab wafer operations. Troubleshoot process issues and implement corrective actions to improve yield and device performance.

As Tool Owner lead tool matching and variation reduction; own process windows across multiple platforms, and interface directly with suppliers on tool roadmaps. Self-manage technical projects and provide technical team leadership to other Engineers in the organization. Communicate clear project plans and results to senior management. Collaborate with cross-functional teams including R&D, Quality, and Manufacturing to support new product introductions.

Raise overall Post Fab technical capability and influence engineering culture through the mentorship of Engineers in organization. Analyze process data and apply statistical methods to drive continuous improvement. Ensure compliance with safety and quality standards.

Qualifications

Qualifications

Education/Experience: Bachelor’s or higher degrees in Chemical Engineering, Mechanical Engineering, Electrical Engineering, Materials Science, Physics, or related degree. 8 + years of direct work experience in the semiconductor industry with specific experience in driving continuous improvement in manufacturing and developing improved semiconductor processes.

Skills

Strong understanding of semiconductor manufacturing Proficient in SPC, DOE, and data analysis tools. Demonstrated success in yield, throughput, and cost improvement initiatives. Proficient with structured problem-solving tools and how to apply them to lead improvement actions that result in positive technology and business outcomes. Familiarity with standard metrology, inspection, and failure analysis techniques. Ability to own, lead, and drive product development and technology improvement.

Self-motivated, detail-oriented, and results-driven. Strong communication skills, both written and verbal; and a collaborative mindset. Ability to work effectively in a team and provide hands-on support and mentorship to other Engineering and Operations staff. onsemi is excited to share the base salary range for this position is $102,600-$179,600 exclusive of fringe benefits or potential bonuses. The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, and/or consideration of internal equity of our current team members.

We also offer a competitive benefits package. https://www.onsemi.com/site/pdf/Benefits-Summary-USA.pdf