Engr II, Manufacturing Equip; MFG
Listed on ON Semiconductor ’s official careers site. Posted July 21, 2026. Check that it is still open and apply there.
Apply on ON Semiconductor ’s careers site →Job description
We are seeking an experienced and highly technical Senior Equipment Engineer to lead our front end assembly equipment team. You will be responsible for leading shift technicians, ensuring maximum equipment uptime, and performing advanced troubleshooting across our die bond, clip bond, reflow, and inspection lines. The ideal candidate must have strong hands-on engineering experience with ASM equipment and front end assembly processes.
Responsibilities
Technician Leadership
Lead, supervise, and mentor a team of shift technicians to ensure strict adherence to maintenance schedules and production KPIs.
Machine Issue Follow-up
Take ownership of chronic, unresolved, or escalated machine issues handed over from previous shifts, conducting deep-dive root cause analysis for permanent resolution.
Equipment Maintenance & Calibration
Oversee and execute corrective and preventive maintenance (PM) for die attach, clip bond, reflow, oven, and AOI equipment to minimize downtime.
Process Optimization
Monitor Overall Equipment Effectiveness (OEE),Uptime,production time.
Documentation
Establish, review, and update Standard Operating Procedures (SOP), troubleshooting matrices, and technical training materials for the engineering team.
Qualifications
Candidates must have hands-on experience in operation, setup, troubleshooting, or maintenance for the following equipment: Die Bonder : ASM AD838, AD8312PLUS, DA D510, ALPHASAM Clip Bonder : AD830CB, AD830PLUS, BESTEM-C310 Reflow & Ovens : RO830, RO832, BOCS-6 (Reflow), PINK VADU (Vacuum Soldering System)
Screen Printer
ASM DEK Cleaning Systems : CREST, Automated Optical Inspection (AOI) : PENTAMASTER AOI Requirements: Education: Bachelor’s Degree in Mechanical, Mechatronics, Electrical, or Electronic Engineering.
Experience
Minimum 3–5+ years of solid engineering experience in semiconductor Front assembly (Die Bond / Clip Bond line preferred).
Technical Skills
Expertise in ASM die bond platforms, Solder Phasa bonding mechanisms, and vision systems. Proficient in engineering problem-solving tools (8D, FMEA, SPC, 5-Why, Fishbone).
Leadership
Proven track record of managing shift technicians and driving team performance under pressure.
Working Hours
Must be willing to support shift teams, handle escalations, and work flexible hours when required.
More jobs at ON Semiconductor
Engr I, Manufacturing Equip; MFG
Seremban, Negeri Sembilan, Malaysia
Engr II, Manufacturing/ Automation Engineer
Seremban, Negeri Sembilan, Malaysia
Engr II, Manufacturing; MFG
Seremban, Negeri Sembilan, Malaysia
Similar jobs at other companies
Manufacturing Equip Maint Technician 3 (R)
Sanmina-SCI · Tlajomulco de Zuniga, Jalisco, Mexico
Operator – MFG Equip II
Baker Hughes Company · Houston, TX, US
Operator – MFG Equip IV
Baker Hughes Company · Houston, TX, US
Engr, Mfg Design 2
KLA · Singapore