Plasma ETCH Process Engineer

Job description

The Plasma Etch Process Engineer (G4) is responsible for sustaining and improving plasma etch processes to achieve safety, quality, cycle time, cost, and yield objectives within a semiconductor manufacturing environment. The engineer develops and qualifies process recipes, analyzes process and equipment data, drives root cause investigations, and implements corrective actions to improve manufacturing performance and product reliability.

This role partners closely with equipment engineering, manufacturing, metrology, yield enhancement, and integration teams to resolve technical issues and support production goals. The engineer leads process characterization activities, executes experiments, and manages process changes through established change control and qualification procedures. A G4 engineer is expected to work independently on moderately complex technical problems, provide technical guidance to technicians and junior engineers, and contribute to continuous improvement initiatives across the factory.

More information about NXP in the United States... NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals. #LI-97b2