Process Engineer

Job description

Job Summary

Seeking a Process Engineer with 3-5 years of semiconductor industry experience in Wafer Saw (Dicing), Blade Dicing, Backgrind, or DBG processes .

Job Responsibility Define/optimize procedures to ensure smooth processing of production lots

• Develop and maintain process documentation and SOPs including operator training
• Lead root cause analysis for defects and yield losses
• Provide disposition on lots with quality issues
• Support new product introduction and process qualification
• Analyze production data to identify process improvements
• Collaborate with cross-functional teams on cost reduction and process improvement projects
• Perform change management including new material qualification Qualification
• Bachelor's or master's degree in Engineering (Electronics, industrial, Chemical, Mechanical, or related field). 3–5 years of process engineering experience with standard backgrind and dicing before grinding (DBG) process.

Strong data analysis and problem-solving skills. Experience with Statistical Process Control (SPC) and process validation (preferred). With good command of English language. Knowledge of Lean, Six Sigma, or continuous improvement tools (advantage). More information about NXP in Thailand... #LI-e5f2