NXP Semiconductors · Kuala Lumpur
Package Roadmap Tool Intern – Package Innovation
Listed on NXP Semiconductors’s official careers site. Listed as of October 19, 2026. Check that it is still open and apply there.
Apply on NXP Semiconductors’s careers site →Job description
Package Roadmap Tool Intern – Package Innovation
Role Summary
Develop and enhance tools to enable structured definition, visualization, and management of package technology roadmaps across platforms.
Key Responsibilities
- Design and implement a Package Roadmap Tool to track technology evolution, capabilities, and platform alignment
- Participate and support Platform Manager lead to integrate inputs from business lines, competitive analysis, and supplier data into a centralized roadmap framework
- Improve data structure, usability, and automation of roadmap tracking (e.g., dashboards, visualizations)
- Participate and support Platform Manager lead for roadmap reviews and ensure alignment with PI strategy, cost targets, and technology readiness
- Collaborate cross-functionally with platform, API, and manufacturing teams
Additional Exposure
- Participate in ATKL manufacturing projects to build foundational knowledge of package assembly and process flows Qualifications Degree candidate in Computer Science (preferred), Engineering, or related field
- Strong programming and data structuring skills (e.g., Python, data tools, automation frameworks) Experience with Excel, Power BI, or similar tools for visualization and tool development
- Ability to translate technical inputs into structured, scalable frameworks Self-driven with strong collaboration and communication skills More information about NXP in Malaysia... #LI-633a
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