External Package Innovation Engineer

Job description

Hiring

External Package Innovation Engineer We are looking for a highly motivated engineer to drive external package innovation initiatives and collaborate closely with OSAT partners for successful project execution. 🔹 Role Overview As an EPI engineer , you will act as both a Role Owner and Key Supporter for OSAT-related development activities, ensuring robust execution from concept through production. 🔹 Key Responsibilities ✅ 1.

Role Owner (Strategic & Governance)

• Own and lead OSAT-wide and cross-OSAT initiatives
• Define and deploy standard development templates and success criteria across OSATs
• Drive deployment of Best Known Methods (BKM) and lessons learned
• Develop and maintain technology roadmap and capability assessment for each OSAT site Provide Package Innovation (PI) input for: External site sourcing strategy Site selection process (jointly with interface manager)

Lead project governance , including

Overall project summaries Stoplight reporting Regular reviews per OSAT site ✅ 2.

Supporter (Execution & Project Delivery) Support NPI & NTI projects executed at external OSAT factories Ensure OSAT compliance with: Development processes Required documentation/templates

• Drive alignment on SME (Subject Matter Expert) assignment at OSAT Support and resolve technical and project issues on-site and across time zones
• Ensure assembly readiness and safe production launch 🔹 Stakeholder Collaboration You will work closely with cross-functional teams, including: Project Leaders & Development Managers Designers & Materials Engineers Tech Integration & Modelling teams (Electrical, Mechanical, Thermal) API and WLP/PLP/FC SMEs OSAT partners 🔹 What We’re Looking For Strong experience in semiconductor packaging (especially with handson assembly process experience such as pre-assembly and wire bonding).

Previous exposure to OSAT ecosystem is an added advantage.

• Proven ability to manage cross-site, cross-functional projects
• Solid understanding of NPI/NTI development flows
• Excellent stakeholder management and communication skills
• Ability to drive standardization, governance, and technical problem-solving 🌟 Why Join Us Opportunity to lead high-impact package innovation initiatives
• Work with global teams and OSAT partners for wide exposure and fast knowledge & skill growth
• Drive technology roadmap and next-generation packaging solutions More information about NXP in Malaysia... #LI-633a