Wafer Fab Integration Engineering Technician (Weekday Day Shift)

Job description

Job Summary

Nokia’s Photonic Integrated Circuit (PIC) wafer fabs in Sunnyvale and San Jose focus on the production and R&D of advanced Indium Phosphide (InP) semiconductor devices. As a Wafer Fab Integration Engineering Technician, you will play a critical role in supporting wafer fabrication processes, improving product quality, and reducing defects. This position offers the opportunity to work closely with cross-functional engineering teams to troubleshoot complex process issues, enhance yield and reliability, and contribute to the ramp-up of a high-volume manufacturing facility in San Jose.

You will be part of a collaborative environment that emphasizes teamwork, continuous learning, and cutting-edge semiconductor innovation.

Responsibilities

Key Responsibilities

• Investigate root causes for production lots placed on hold and drive corrective actions
• Troubleshoot performance issues and yield excursions within the wafer fabrication process
• Support engineering tool qualifications and process validations

Assist engineers with failure analysis, including

• Visual inspections o CD-SEM measurements
• Electrical IV testing
• Profilometry depth measurements
• Utilize Manufacturing Execution Systems (MES) to:
• Collect and track data
• Perform basic data analysis
• Generate reports (e.g., PowerPoint presentations)
• Monitor Statistical Process Control (SPC) charts and provide first-level response to out-of-control conditions
• Coordinate and track qualification and development lots across fabrication, assembly, and test operations
• Ensure compliance with PIC product quality systems and standards
• Support next-generation PIC platform development, including technology transfer and production ramp
• Collaborate with cross-functional teams to improve process integration, yield, and device performance Work Schedule: Weekday day shift — Monday, Tuesday, Wednesday, and every other Thursday from 6:00 AM to 6:00 PM

Qualifications

Minimum Qualifications & Requirements

• Bachelor’s degree in Science, Engineering, or a related technical field
• Minimum of 3 years of experience in a modern semiconductor fabrication environment (5+ years preferred)
• Strong attention to detail with a high commitment to quality
• Demonstrated problem-solving skills and ability to follow through on tasks
• Self-motivated, with a willingness to learn and expand technical skills
• Strong sense of ownership and accountability
• Effective team player with strong verbal and written communication skills
• Ability to manage multiple tasks, prioritize work, and meet deadlines
• Proficiency in using computer systems and software tools for data analysis and reporting Preferred Qualifications:
• Experience with Indium Phosphide (InP) or Gallium Arsenide (GaAs) semiconductor processes
• Familiarity with wafer fab processes such as photolithography, etch, deposition, and CVD