MediaTek · HsinChu

<Data Center> Advanced Package Engineer/ Technical Manager

HsinChuManager or leadData & Analytics

Listed on MediaTek’s official careers site. Listed as of October 23, 2026. Check that it is still open and apply there.

Job description

1. CoWoS and 2.5D package technology development 2. 3D package technology development 3. CPC/CPO package technology development 4. Mobile/WiFi/TV/Automotive package development 5. Package technology integration and NTO handle 6. Package design/SIPI/Layout 7. Package Modeling #LI-JK1

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